Papers

Number of the published data : 286
No. Publishing type Authorship Title Author Journal Publisher Volume/issue/page Publication date ISSN DOI URL Summary
1 Research paper (scientific journal)
Joint
ロータリー型インフィード平面研削メカニズムに関する研究
― 無線式動力計の開発と研削抵抗の評価 ―
石橋憲,月井裕太,蛯名雄太郎,周立波,清水淳,小貫哲平,山本武幸, 尾嶌裕隆
砥粒加工学会誌
砥粒加工学会
63/ 1, 31-35
2019/01




2 Research paper (international conference proceedings)
Joint
Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU
Masatomo INUI, Yutaro Ebina, Tomohiro Maezaki, Libo Zhou
Proceedings of 14th IEEE International Conference on Automation Science and Engineering (CASE 2018)

1519-1524
2018/08/20




3 Research paper (scientific journal)
Joint
実験とシミュレーションによる砥粒径のばらつきがウエハ研削面に与える影響の調査
蛯名雄太郎,前崎智博,周立波,清水淳,小貫哲平,尾嶌裕隆,乾正知
精密工学会誌
精密工学会
84/ 7, 640-645
2018/07

https://doi.org/10.2493/jjspe.84.640.


4 Research paper (scientific journal)
Joint
Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process
Ke Wu, Libo Zhou, Teppei Onuki, Jun Shimizu, Takeyuki Yamamoto and Julong Yuan
Precision Engineering
Elsevier
52, 451-457
2018/04

https://doi.org/10.1016/j.precisioneng.2018.02.007


5 (MISC) Introduction and explanation (commerce magazine)
Only
硬質単結晶ウエハの研削加工の基礎
周立波
機械技術
日刊工業新聞社
66/ 3, 22-27
2018/03




6 Research paper (international conference proceedings)
Joint
Study on Nanoscratching of C-plane Sapphire Wafer
Wangpiao Lin, Jun Shimizu, Libo Zhou, Teppei Onuki, Hirotaka Ojima and Takeyuki Yamamoto
Proceedings of the 20th International Symposium on Advances in Abrasive Technology (ISAAT2017)

1045-1050
2017/12/03




7 Research paper (international conference proceedings)
Joint
Raman analysis of machining qualities on ground surfaces of sapphire wafers
Teppei Onuki, Ke Wu, Nao Sugano, Hirotaka Ojima, Jun Shimizu1 and Libo Zhou
Proceedings of the 20th International Symposium on Advances in Abrasive Technology (ISAAT2017)

1122-1126
2017/12/03




8 Research paper (international conference proceedings)

Development of wireless dynamometer for rotary infeed surface grinding
Yuta Tsukii, Libo Zhou, Hirotaka Ojima, Jun Shimizu and Teppei Onuki
Proceedings of the 20th International Symposium on Advances in Abrasive Technology (ISAAT2017)

293-297
2017/12/03




9 Research paper (international conference proceedings)

Development of Localized Compressive Hydrostatic Pressure-assisted Cutting Method: Cutting Experiment and Molecular Dynamics Simulation using Sliding Element
Jun Shimizu1, Takeyuki Yamamoto, Hirotaka Ojima, Teppei Onuki, Libo Zhou and Hiroto Ashino
Proceedings of the 20th International Symposium on Advances in Abrasive Technology (ISAAT2017)

905-910
2017/12/03




10 Research paper (international conference proceedings)
Joint
Study on the Effect of Grain Size Variation on Ground Surface Roughness
Tomohiro Maezaki, Jun Shimizu, Teppei Onuki, Hirotaka Ojima, Masatomo Inui, Yutaro Ebina and Libo Zhou
Proceedings of 7th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN2017)

HSP-O-02
2017/11/14




11 Research paper (international conference proceedings)
Joint
Development of Classification Method for Micro-particle by using Acoustic Standing Wave Field
Hirotaka Ojima, Tomohiro Inada, Libo Zhou, Jun Shimizu and Teppei Onuki
Proceedings of 7th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN2017)

OPE-O-01
2017/11/14




12 Research paper (international conference proceedings)
Joint
Analysis of variance in optical inspections of wafer thickness
Teppei Onuki, Hirotaka Ojima, Jun Shimizu and Libo Zhou
Proceedings of The 9th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), [Manufacturing & Machine Tool Division, The Japan Society of Mechanical Engineers (JSME)]
JSMA
4pages
2017/11/13




13 Research paper (international conference proceedings)
Joint
Examination of Micro EDM Deposition Mechanism using Thin Cu-W Electrode
Masato Ishii, Itaru Takahama, Takeyuki Yamamoto, Jun Shimizu, Libo Zhou, Teppei Onuki, Hirotaka Ojima
Proceedings of The 9th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), [Manufacturing & Machine Tool Division, The Japan Society of Mechanical Engineers (JSME)]
JSME
4pages
2017/11/13




14 Research paper (scientific journal)
Joint
Theoretical analysis on effects of grain size variation
Libo Zhou, Yutaro Ebina, Ke Wu, Jun Shimizu, Teppei Onuki, Hirotaka Ojima
Precision Engineering
Elsevier
50/ 10, 27-31
2017/10

10.1016/j.precisioneng.2017.04.010

Grinding wheels consist of abrasive grains, bonding materials and porous, which are specified by five factors; type of grain, size of grain, bonding material, bonding strength and grain concentration or volume fraction of grain. The grain size is represented by the mean diameter/radius of grains. However, the abrasives in a grinding wheel are randomly scraggly in size and shape. There is no particular aspect to regulate the variation in grain size. This paper addresses, via a theoretical analysis on the distribution of grain size, the average volume of a grain, the number of grains contained in a specific volume of the wheel, the number and protrusion distribution of grains exposed in a wheel working surface and the fraction of effective grain, when the grain size varies. The effect on the resultant finished surface roughness is also discussed.
15 Research paper (scientific journal)
Joint
Study on the potential of chemo-mechanical-grinding (CMG) process of sapphire wafer
Ke Wua, Libo Zhoub, Jun Shimizu, Teppei Onuki, Takeyuki Yamamoto, Hirotaka Ojima and Julong Yuan
The International Journal of Advanced Manufacturing Technology
Springer
91/ 5-8, 1539-1546
2017/07

10.1007/s00170-016-9836-1

This paper aims to study the potential of CMG in manufacturing of single crystal sapphire wafers. The basic material removal mechanism in terms of chemical effect and mechanical effect in CMG process has been analyzed based on experiment results of two different kinds of CMG wheels. The experiment results suggest that chromium oxide (Cr2O3) performs better than silica (SiO2) in both material removal rate (MRR) and surface quality. It also reveals that, no matter under dry condition or wet condition, CMG is with potential to achieve excellent surface quality and impressive geometric accuracy of sapphire wafer.
16 Research paper (scientific journal)
Joint
シリコンウェハ変形による加工変質層残留応力の評価,-有限要素法を用いた数値シミュレーションによるウェハ変形メカニズム解明-
髙橋清樹,周 立波,清水 淳
精密工学会誌
精密工学会
83/ 5, 426-432
2017/05

10.2493/jjspe.83.426

有限要素法による数値シミュレーションを用いて,加工変質層の残留応力によるウェハ変形メカニズムの解明を試み,残留応力と反り変形量の関係を検討した.微小変形の範疇では球面たわみ形状を示すウェハが,厚さを超えるたわみレベルでは変形形態を一変させ,最終的には大きな円筒変形に達する.本研究では,球面変形から円筒変形までそのたわみ量を残留応力と関連付け,簡易的な残留応力の評価手法を提案すると同時に,座屈変形の臨界条件や単結晶Siの結晶方位が及ぼす影響を明らかにする.
17 Research paper (international conference proceedings)
Joint
Development of localized compressive hydrostatic stress-assisted cutting method
– Examination by molecular dynamics simulation and microcutting experiment
Jun Shimizu, Takeyuki Yamamoto, Hirotaka Ojima, Teppei Onuki, Libo Zhou, Keito Uezaki
Proceedings of euspen's 17th International Conference & Exhibition, [The European Society for Precision Engineering and Nanotechnology(euspen)]

279-280
2017/05/29




18 Research paper (scientific journal)
Joint
ナノ接触実験結果と酸化膜の影響を考慮したすべり摩擦の分子動力学シミュレーション
清水 淳,周 立波,小貫哲平,尾嶌裕隆,三輪紘敬,南部俊和
トライボロジスト

61/ 12, 845-859
2016/12




19 Research paper (international conference proceedings)
Joint
Study on micro EDM deposition in Ar atmosphere
Itaru Takahama, Takeyuki Yamamoto, Jun Shimizu, Libo Zhou, Teppei Onuki and Hirotaka Ojima
Proceedings of 16th International Conference on Precision Engineering (ICPE2016)
JSPE
1-2
2016/11




20 Research paper (international conference proceedings)
Joint
Stress analysis of LT wafer during grinding process
Wentong LU, Libo ZHOU, Jun SHIMIZU, Teppei ONUKI, Hirotaka OJIMA, Takeyuki YAMAMOTO
Proceedings of 16th International Conference on Precision Engineering (ICPE2016)
JSPE
1-2
2016/11




21 Research paper (international conference proceedings)
Joint
Stability investigation of laser ablation micromachining on ferroelectric lithium niobate substrates
Kazuki KAMOSHIDA, Teppei ONUKI, Takeyuki YAMAMOTO, Hirotaka OJIMA, Jun SHIMIZU and Libo ZHOU
Proceedings of 16th International Conference on Precision Engineering (ICPE2016)
JSPE
1-2
2016/11




22 Research paper (international conference proceedings)
Joint
Error characteristics analyses in optical wafer-thickness measurements
Teppei ONUKI, Yuki NEMOTO, Hirotaka OJIMA, Jun SHIMIZU, Libo ZHOU
Proceedings of 16th International Conference on Precision Engineering (ICPE2016)
JSPE
1-2
2016/11




23 Research paper (international conference proceedings)
Joint
Theoretical analysis on effects of grain size variation
Libo Zhou, Yutaro Ebina, Ke Wu,
Jun Shimizu, Teppei Onuki, Hirotaka Ojima
Proceedings of the 19th International Symposium on Advances in Abrasive Technology (ISAAT2016)

124-129
2016/10




24 (MISC) Introduction and explanation (commerce magazine)
Only
固定砥粒による無歪み研削(CMG)技術とシリコンウエハの薄片化加工
周立波
機械技術
日刊工業新聞社
64/ 11, 54-57
2016/10




25 Research paper (scientific journal)
Joint
定在波音場を用いた産業廃棄物分別方法の開発
稲田 智広,周 立波,尾嶌 裕隆,清水 淳
日本機械学会論文集C編
日本機械学会
82/ 841, 1-9
2016/09

http://doi.org/10.1299/transjsme.16-00031


26 Research paper (scientific journal)
Joint
金属のねじり変形に及ぼす圧縮静水圧応力の影響 ―分子動力学による解析―
植崎 圭人,清水 淳,周 立波
精密工学会誌
精密工学会
448-453
2016/05

http://doi.org/10.2493/jjspe.82.448


27 Research paper (scientific journal)
Joint
Study on grinding of LiTaO3 wafer using effective cooling andelectrolyte solution
Wei Hang, Libo Zhou, Kehua Zhang, Jun Shimizu, Julong Yuan
Precision Engineering
Elsevier
44/ 4, 62-69
2016/04




28 Research paper (scientific journal)
Joint
ステレオ画像による砥石作業面トポグラフィの機上3次元計測システム開発に関する研究
尾嶌 裕隆,長山 拓矢,周 立波,清水 淳,小貫 哲平
精密工学会誌

82/ 2, 186-191
2016/02




29 Research paper (international conference proceedings)
Joint
Effects of ultrasonic vibration on abrasive pellet working life for Si wafer using ultrasonic assisted fixed abrasive chemical mechanical polishing(UF-CMP)
Mitsuyoshi Nomura, Yutaka Matsushima, Yongbo Wu, Masakazu Fujimoto, Zhou Libo
The 8th International Conference on Leading Edge Manufacturing in 21st Century (LEM21)
JSME
1-5
2015/10




30 Research paper (international conference proceedings)
Joint
Molecular dynamics simulation of relationship between friction anisotropy and atomic-scale stick-slip phenomenon
Jun Shimizu, Libo Zhou, Teppei Onuki, Hirotaka Ojima, Takeyuki Yamamoto
The 8th International Conference on Leading Edge Manufacturing in 21st Century (LEM21)
JSME
1-5
2015/10




31 Research paper (international conference proceedings)
Joint
Study on the Effects of Chemical Agents and Environment on Material Removal Rate in Sapphire Polishing
Ke Wu, Naoki Yamazaki, Libo Zhou, Jun Shimizu, Teppei Onuki, Hirotaka Ojima
The 8th International Conference on Leading Edge Manufacturing in 21st Century (LEM21)
JSME
1-5
2015/10




32 Research paper (scientific journal)
Joint
SiウエハのChemo-Mechanical-Grinding(CMG)に関する研究 ―第3報:砥石に含まれる塩基の作用の解明と砥石物性値の最適化によるCMGの確立 ―
田代 芳章,周 立波,清水 淳,篠田 知顕,三上 祐樹
精密工学会誌

81/ 10, 957-962
2015/10




33 Research paper (international conference proceedings)
Joint
Wide range and accurate measurement of wafer thickness gauge using optical spectral analyzer
Teppei Onuki, Yutaro Ebina, Hirotaka Ojima, Jun Shimizu, Libo Zhou
Applied Mechanics and Materials,

1136, 581-585
2015/10

10.4028/www.scientific.net/AMM.1136.581


34 Research paper (international conference proceedings)
Joint
Study on Sapphire Wafer Grinding by Chromium Oxide (Cr2O3) Wheel
Ke Wu, Naoki Yamazaki, Yutaro Ebina, Libo Zhou, Jun Shimizu, Teppei Onuki, Hirotaka Ojima, Takashi Fujiwara
Applied Mechanics and Materials

1136, 311-316
2015/10

10.4028/www.scientific.net/AMM.1136.311


35 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of a Cutting Method by Making Use of Localized Hydrostatic Pressure
Jun Shimizu, Keito Uezaki, Libo Zhou, Takeyuki Yamamoto, Teppei Onuki, Hirotaka Ojima
Applied Mechanics and Materials

1136, 156-161
2015/10

10.4028/www.scientific.net/AMM.1136.156


36 Research paper (international conference proceedings)
Joint
Surface Texturing by Using Vibration-assisted Microscratching
Jun Shimizu, Takeyuki Yamamoto, Teppei Onuki, Hirotaka Ojima, Libo Zhou
International Tribology Conference (ITC) 2015

1-2
2015/06




37 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Cutting Process Accompanied by a Localized Compressive Hydrostatic Stress Field Formation
Keito Uezaki, Jun Shimizu, Libo Zhou, Takeyuki Yamamoto, Teppei Onuki, Hirotaka Ojima
International Tribology Conference (ITC) 2015

1-2
2015/06




38 Research paper (international conference proceedings)
Joint
Development of Microtextured Titanium Dioxide Surface by Using Microcutting Techniques
Jun Shimizu, Takeyuki Yamamoto, Libo Zhou, Teppei Onuki, Hirotaka Ojima
The 11th International Conference on Ceramic Materials and Components for Energy and Environmental Applications (CMCEE)

1-8
2015/06




39 (MISC) Introduction and explanation (scientific journal)
Joint
脆性機能性材料(ニオブ酸リチウム)のピコ秒レーザ微細加工技術
小貫哲平, 清水 淳, 山本武幸, 尾嶌裕隆, 周 立波
レーザ加工学会誌
レーザ加工学会
22/ 2, 98-103
2015/06
1881-6797



40 Research paper (scientific journal)
Joint
Process study on large-size silicon wafer grinding by using a small-diameter wheel
Yutaro EBINA, Tomoya YOSHIMATSU, Libo ZHOU, Jun SHIMIZU, Teppei ONUKI and Hirotaka OJIMA
Journal of Advanced Mechanical Design, Systems, and Manufacturing (Bulletin of the JSME)

9/ 5, 1-11
2015/05

10.1299/jamdsm.2015jamdsm0073


41 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Abrasive Machining Process of Silicon Wafer by Controlling Interatomic Potential
Jun Shimizu, Takeyuki Yamamoto, Libo Zhou, Teppei Onuki, Hirotaka Ojima
Program and Abstract Book of The 6th Advanced Forum on Tribology

12
2015/04




42 Research paper (scientific journal)
Joint
Modeling of process mechanisms in pulsed laser micro machining on lithium niobate substrates
Teppei Onuki, Ippei, Murayama, Hirotaka Ojima, Jun Shimizu and Libo Zhou
Journal of Automation Technology

8/ 6, 896-902
2014/11



The mechanism behind the laser ablation of LN is investigated using near infrared pico-second-pulsed laser. A model of the mechanism is developed, deriving the mechanical, thermal, and photonic properties of LN in addition to doing preliminary experiments on laser ablation with controlled laser fluence. β is material removal using the nonthermal process via multiphoton ionization, γ is nonthermal material removal with chipping or cracking produced by generated heat (but at temperatures below the melting point), and δ is material removal using the thermal process with temperatures above the melting point, resulting in resolidification at the surface and the adhesion of once molten burrs around the processed area. In a process
modes map constructed through exhaustive experiments
on laser ablation under various irradiation conditions (at specific energy ρ and with number of pulse shots N), different contributions of ρ and N in the machining process are found. In terms of machining quality, desirable conditions in the control of laser irradiations are the use of weaker ρ and increased N to keep thermal damage to a minimum and to raise the removal rate.
43 Research paper (international conference proceedings)
Joint
Influence of surface integrity in silicon wafer thickness measurements by reflection spectroscopy
Teppei Onuki, Ryusuke Ono, Hirotaka Ojima, Jun Shimizu, Libo Zhou
Advanced Materials Research

1017, 681-685
2014/09

10.4028/www.scientific.net /AMR.1017.255


44 Research paper (international conference proceedings)
Joint
Wafer Grinding of Using Fixed Abrasive Diamond Wheel - Evaluation of cutting edge distribution in Diamond Wheels -
Yutaro Ebina, Libo Zhou, Jun Shimizu, Teppei Onuki, Hirotaka Ojima
Advanced Materials Research

1017, 255-260
2014/09

10.4028/www.scientific.net /AMR.1017.255


45 Research paper (international conference proceedings)
Joint
Development of non-contact classifying systems by use of acoustic levitation
Tomohiro Inada, Libo Zhou, Jun Shimizu, Hirotaka Ojima, Takuya Ito
Advanced Materials Research

1017, 586-591
2014/09

10.4028/www.scientific.net/AMR.1017.586


46 Research paper (scientific journal)
Joint
近赤外分光器を用いた反射分光方式の薄シリコンウェハ厚さ計
小貫哲平,小野竜典,尾嶌裕隆,清水淳,周立波
砥粒加工学会誌

58/ 8, 515-519
2014/08



裏面研削によるシリコンウェハ薄化工程で用いる厚さ計として反射分光式厚さ測定法が有望である.本方式の計測特性を決める最も重要な装置構成要素は分光器の特性である.本研究はシリコンの光学特性と計測原理に適用した分光器仕様条件を求め,入手可能な分光器の中から最適なものを選定した.選定した分光器を用いて厚さ50um から5um,寸法公差0.1um 以下のウェハ加工での使用のための厚さ計試作機を構築し,測定可能範囲の様々な厚さの薄ウェハ片を用いた実測実験により本構成条件の有効性を示した.
47 Research paper (international conference proceedings)
Joint
Development of Areal Wavelet Transform for the 2D images
Hirotaka OJIMA, Taiju SUZUKI, Libo ZHOU, Jun SHIMIZU and Teppei ONUKI
Proceedings of 15th Int'l Conference on Precision Engineering (ICPE2014)

836-837
2014/07




48 Research paper (international conference proceedings)
Joint
Comparative Investigations of Analysis Methods in Thickness Inspections of Ultra Thin Semiconductor Wafers by Means of White Light Reflectmetry
Teppei ONUKI, Hirotaka OJIMA, Jun SHIMIZU and Libo ZHOU
Proceedings of 15th Int'l Conference on Precision Engineering (ICPE2014)

836-837
2014/07




49 Research paper (international conference proceedings)
Joint
Development of Microtextured Photocatalytic Surface by Vibration-assisted Scratching
Jun Shimizu, Takeyuki Yamamoto, Libo Zhou, Teppei Onuki, Hirotaka Ojima
Materials Science Forum

783-786, 1488-1493
2014/04

10.4028/www.scientific.net/MSF.783-786.1488


50 Research paper (scientific journal)
Joint
Development of metal cutting process accompanied by a localized compressive hydrostatic stress field formation: Examination by molecular dynamics simulation
Keito Uezaki, Jun Shimizu, Libo Zhou
Precision Engineering

38/ 2, 371-378
2014/04

10.1016/j.precisioneng.2013.12.002

Improving machined surface integrity is important for precision machining. The aim of this work is to develop a cutting tool, which enables to generate a localized compressive hydrostatic stress field in the vicinity of cutting point to suppress unnecessary plastic flow and to improve the surface integrity of workpiece. In this paper, as the first step a simple cutting tool attached with a laminar jig equipped with a small rectangular hole for cutting chip elimination was proposed, and a molecular dynamics simulation of nano-cutting of monocrystalline aluminum was performed in order to verify and reveal the effectiveness and issues, respectively, of proposed method for improving machined surface integrity. The obtained simulation results were also compared to those using a normal cutting tool in order to clarify the cutting mechanism. As a result, it was clarified that a high compressive hydrostatic stress field was successfully introduced in the vicinity of cutting point. Consequently, the burr formation and elimination of cutting chip were remarkably suppressed and smoothened, respectively by using proposed cutting tool.
51 Research paper (international conference proceedings)
Joint
Control of the incubation effects in pulsed laser micro machining on ferroelectric lithium niobate substrates
Teppei ONUKI, Ippei MURAYAMA, Takeyuki YAMAMOTO, Hirotaka OJIMA, Jun SHIMIZU and Libo ZHOU
Proceedings of 6th Int’l Conference on Leading Edge Manufacturing in 21st Century (LEM21)

67-70
2013/11



Incubation effects in the material removal and the surface integrity of LN are investigated for damage-free, precious steric micro processing from the results of preliminary micro processing experiments of laser ablation via the multi photon process with controlled incubation effects in scanning laser multi pulse shots. Advisable process conditions are larger N and smaller for control of the incubation effects.
52 Research paper (international conference proceedings)
Joint
Three-dimensional cutting edge distribution of abrasives on diamond grinding wheel working surface
Libo ZHOU, Yutaro EBINA, Jun SHIMIZU, Teppei ONUKI, Hirotaka OJIMA, and Takeyuki YAMAMOTO
Proceedings of 6th Int’l Conference on Leading Edge Manufacturing in 21st Century (LEM21)

79-84
2013/11



The wafer grinding by use of a diamond grinding wheel is required to create a high-quality wafer surface in a short time. In general, it is known that high-quality wafer surface can be obtained by reducing the amount of material removal per abrasive cutting edge.  In other words, an excellent surface quality is obtainable by an increasing in the areal density of effective abrasive cutting edge on the grinding wheel working surface. In this study, we aim to understanding of the three-dimensional distribution of abrasive grains on diamond wheel working surface, from both theoretical and experimental aspects, and evaluation its influence on the grinding performance.
53 Research paper (international conference proceedings)
Joint
Development of fixed diamond abrasive pellet for final finishing of mono-crystallined sapphire wafers
Yoshiaki TASHIRO, Libo ZHOU, Jun SHIMIZU, Noriaki SHINODA, Yoshinori MITSUI
Proceedings of 6th Int’l Conference on Leading Edge Manufacturing in 21st Century (LEM21)

298-301
2013/11



Free abrasive machining has been widely used for the finishing of mono-crystallined sapphire wafers. There are, however, critical issues remaining, such as degradation of flatness due to the nature of pressure controlled in-feed dynamics, environmental load due to disposal of wasted slurry, and time/cost consuming. Fixed abrasive machining is one of the potential alternatives to make a breakthrough to such problems. This study aims to development of fixed diamond abrasive pellet for final finishing of mono-crystallined sapphire wafers.
54 Research paper (scientific journal)
Joint
Development of Finishing System using Acoustically Levitated Abrasive
Tomohiro Inada, Libo Zhou, Hirotaka Ojima and Jun Shimizu
International Journal of Automation Technology

6/ 7, 671-677
2013/11



Based on the acoustic levitation phenomenon, we propose and develop an acoustic levitation / positioning system to control the movements of free abrasives to finish inner surfaces. Described in this paper are the theoretical analysis of levitation forces generated in a standing wave field and the results of experiments involving levitation and positioning. We first calculate the wave amplitude and frequency required to levitate the abrasives. Based on the results, we develop a system consisting of a sound transducer (speaker), a reflector (an aluminum plate), an amplifier, and a function generator, and we successfully not only levitate but also position actual abrasives in a tube. We find that the relation between the size and density of the abrasives and the strength of the acoustic field (wave amplitude and frequency) basically agree with the theoretical prediction. In addition, the kinetics of levitated abrasives, including their positions and movements, are precisely controlled by varying the wave frequency and switching from one node position to another.
55 Research paper (scientific journal)
Joint
Study on the mechanical properties of lithium tantalate and the influence on its machinability
Wei Hang, Libo Zhou, Jun Shimizu, Julong Yuan and Takeyuki Yamamoto
International Journal of Automation Technology

6/ 7, 644-653
2013/11



As a typical multi-functional single crystal material, lithium tantalate (LiTaO3 or LT) exhibits its excellent electro-optical, piezoelectric properties and has now found many applications, such as electro-optical modulators, pyroelectric detectors, optical waveguide, piezoelectric transducers and SAW (surface acoustic wave) substrates. Although LT is known as a very brittle material, however, detailed summaries of its mechanical properties and machinability are not readily available yet. In order to clarify and understand the fundamental mechanical properties of LT, micro/nano indentation tests are conducted in this study to evaluate elastic modulus, hardness and fracture toughness. Other two typical single crystals of silicon and sapphire are chosen for comparison. The obtained results are analyzed and discussed to understand their behaviors in elastic, plastic (ductile) and brittle regimes, and the influences on their machinability in the machining process.
56 Research paper (scientific journal)
Joint
Mould Pattern Fabrication by Nanoscratching
Jun Shimizu, Wataru Ohsone, Takeyuki Yamamoto, Hirotaka Ojima, Teppei Onuki, Libo Zhou and Han Huang
International Journal of Automation Technology

6/ 7, 686-693
2013/11



MEMS technologies for various nano/micro-devices often requires special facilities and complicated,multistage
processes. The fabrication cost is thus extremely high. Consequently, alternative solutions have been sought, and NanoImprint Lithography (NIL) is one of the potential solutions. To date, the nano/micro molds for NIL are mainly fabricated using photolithography or focused ion beams. However, such beam methods generally make use of special instruments and require a long time to draw precise patterns. Thus, this study aims to fabricate nanoscale
structures on monocrystalline silicon substrates using
nanoscratching, which can potentially be used to fabricate
nano/micro-molds for NIL. This paper discusses how various nano/micro-scale structures such as lineand-space, single-layer, and multiple-layer structures were fabricated on a silicon substrate using nanoscratching by an atomic force microscope equipped with a sharp probe made of monocrystalline diamond. Subsequent chemical etching was also conducted on the fabricated groove patterns to enlarge the depth of the fabricated groove patterns. The results confirmed that the groove was deepened several times, with only a slight increase in its width. A nanoimprint experiment was also carried out, and the line-and-space patterns were duplicated successfully on a polycarbonate
resin film.
57 Research paper (scientific journal)
Joint
Mirror surface finishing of silicon wafer edge by UF-CMP (ultrasonic assisted fixed-abrasive CMP)
Yongbo Wu, Weiping Yang, Mas akazu Fujimoto and Libo Zhou
International Journal of Automation Technology

6/ 7, 663-670
2013/11



As a promising technology for the machining of large-sized Si wafer, Chemo-Mechanical Grinding (CMG) integrates the advantages of fixed abrasive machining and chemical mechanical polishing (CMP), and hence can generate superior surface quality comparable to that by CMP while maintaining the high geometric accuracy. In order to enhance the material removal rate (MRR), attain the work-surface with few damage or defects, and then promote the popularization of CMG, a new combined grinding method, i.e., elliptical ultrasonic vibration assisted CMG (EUA-CMG) is proposed. Some analysis and experiments are conducted to reveal the processing characteristics of EUA-CMG of single crystal silicon. The result shows that compared with the conventional CMG without ultrasonic vibration, better surface quality and higher material removal rate (MRR) can attained in EUA-CMG.
58 Research paper (international conference proceedings)
Joint
Surface Texturing by Making Use of Microploughing
Jun Shimizu, Takeyuki Yamamoto, Libo Zhou, Teppei Onuki, Hirotaka Ojima
Extended Abstracts of 5th World Tribology Congress (WTC 2013)

615.PDF
2013/09




59 Research paper (international conference proceedings)
Joint
Fabrication of Surface Microtexture by Vibration Assisted Cutting
Jun Shimizu, Takeyuki Yamamoto, Libo Zhou, Hirotaka Ojima, Teppei onuki and Shun-ichi Nagaoka
Advanced Materials Research

797, 638-641
2013/09

10.4028/www.scientific.net/AMR.797.638

Improving materials surface function by introducing nano/micro surface textures is of great interest in various fields. The authors have also achieved an improvement in the photocatalytic surface function by introducing the microcutting grooves texture on the titanium dioxide surfaces. In this report, the authors performed the vibration assisted cutting to fabricate finer surface
microtextures anticipating future usage as microtexture moulds for the nanoimprinting and/or injection moulding. In the experiment, a pure copper plate was cut by a sharply pointed triangular diamond tip vibrated in the direction of cutting depth with um order amplitude and kHz order
frequency by a fast tool servo system. As a result, it was found that the periodical micro concave-convex patterns with the combinations of impressions and pileups can be obtained by the proposed method using almost the same vibration amplitude as the cutting depth. It was also achieved
that a micro-textured surface with numerous concave-convex patterns less than 1 um in height with 3 um in pitch.
60 Research paper (international conference proceedings)
Joint
A Thin Silicon Wafer Thickness Measurement System by Optical Reflectmetry Scheme Using Fourier Transform Near-Infrared Spectrometer
Teppei Onuki, Ryusuke Ono, Akira Suzuki, Hirotaka Ojima, Jun Shimizu
and Libo Zhou
Advanced Materials Research

797, 549-545
2013/09

10.4028/www.scientific.net/AMR.797.549

In this study, measurable thickness range was improved by re-customized components of the thickness measurement system using the method of Fabry-Perot interference signature analyzing. A Fourier transform near infrared (FT-NIR) spectrometer with indium gallium arsenide was used in
the developed system. As a result of the sensitiveness in the whole near infrared band and high spectral resolution united with high signal noise ratio of the FT-NIR spectrometer, the maximum measurable thickness is improved to 88um while sub-micron order of the minimum measurable thickness is also improved.
61 Research paper (international conference proceedings)
Joint
Study on thermal influence of grinding process on LiTaO3
Wei Hang, Libo Zhou, Jun Shimizu and Julong Yuan
Advanced Materials Research

797, 252-257
2013/09

10.4028/www.scientific.net/AMR.797.252

As a typical multi-functional single crystal material, Lithium tantalate (LiTaO3 or LT) exhibits its excellent electro-optical, pyroelectric and piezoelectric properties, and has now been widely applied into many applications, especially in the telecommunication field. However, the most critical issue in the process is its pyroelectric effect and piezoelectric effect which potentially leads to crack initiation during grinding. Because it is rich in plasticity, LT demands larger specific energy for material removal. As the most machining energy is eventually converted into heat, LT undergoes a rapid rise in temperature during the grinding process, thus highly risks in thermal shock. In order to clarify the thermal influence on the grinding process of LiTaO3, the effects of coolant temperature, diamond grinding wheel geometry and material of substrate are investigated in this research. The experimental results show that the increasing rate of grinding torque (or force) and surface roughness are two major factors dominating the crack initiation during grinding of LT wafers. Via a DOE (design of experiment) analysis, coolant temperature and wheel type stand out as the main factors influencing on the increasing rate and wafer surface roughness.
62 Research paper (scientific journal)
Joint
大口径Si ウエハ表面形状の計測評価技術に関する研究 ―第2報:ウェーブレット変換を用いたノイズ除去手法の適用―
尾嶌裕隆,周 立波,清水 淳
精密工学会誌

79/ 7, 677-681
2013/07

10.2493/jjspe.79.677

In this research, we have been developing the denoising method by use of wavelet transform. In previous report, this method was investigated by comparison with conventional low-pass filter and Fourier transform. It was concluded that wavelet transform was more effective for elimination of white noise and this method was capable of removing the noise not only in the frequency domain, but also in amplitude domain. In this report, the denoising method by use of wavelet transform is applied into evaluation of Si wafer profile data which is acquired by an actual measurement system. As the acquired data includes not only the white noise but also the inherent noise introduced by the measurement system itself, it is found that the proposed method of filtering white noise in both frequency and amplitude domains is insufficient to improve GBIR (Global Backside Ideal Range which is also equal to peak-to-valley). The cutoffs used in the proposed method are then fine-turned via least-square procedure. The results demonstrate the validation of newly designed filter in GBIR improvement.
63 Research paper (scientific journal)
Joint
A robust procedure of data analysis for micro/nano indentation
Wei Hang, Libo Zhou, Jun Shimizu and Julong Yuan
Precision Engineering

37/ 2, 408-414
2013/02/08

10.1016/j.precisioneng.2012.11.003

This paper reported a robust procedure of data processing in micro/nano indentation for determining the elastic modulus and hardness. As both elastic modulus and indentation hardness strongly depend on the contact stiffness, the contact area and the accuracy with which they are determined, described in the first part of this paper was a comparison of three approaches to estimate the contact stiffness. From the experimental results, it is concluded that the contact stiffness computed from the curve fitting method is most reliable and robust. Subsequently in the second part of this paper, a new procedure for computation of the contact area was proposed by use of multivariable estimation via a least square fitting. In the final part of this paper, indentation tests on silicon and aluminum alloy were conducted to verify that the proposed procedure is not only valid for a variety of materials from hard-brittle to soft-ductile, but also robust and applicable to indenters with imperfect geometry.
64 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Energy Dissipation Process in Atomic-Scale Stick-Slip Phenomenon
Jun Shimizu, Libo Zhou and Takeyuki Yamamoto
Tribology Onlin

8/ 1, 38-43
2013/01
1881-2198
DIO 10.2474/ytoi.8.38


65 Research paper (scientific journal)
Joint
Deformation and removal characteristics of LiTaO3 single crystals in nanoindentation and nanoscratch
Anshun He, Han Huang and Libo Zhou
Int. J. of Abrasive Technology

5/ 3, 258-269
2012/12



The deformation and removal characteristics of lithium tantalate (LiTaO3) single crystal were investigated using nanoindentation and nanoscratch. During indenting, the occurrence of pop-in was associated with the transition of deformation from elastic to elasto-plastic. Slip bands were observed on the indented surface when the indentation load reached 4 mN. Slipping was along the crystal orientation of [1012]. Nanoscratch revealed that the threshold normal load for the transition of removal modes from ductile to brittle was 2.5 mN, corresponding to a scratch depth of 70 nm. Cracks were found along scratched grooves, which were likely induced by shearing. The removal rate in nanoscratch increased with the increase in normal load, but remained
unchanged after the load was greater than 4 mN.
66 Research paper (international conference proceedings)
Joint
Investigation into Chemo-Mechanical Fixed Abrasive Polishing of Fused Silica with the Assistance of Ultrasonic Vibration
Yaguo Li, Yongbo Wu, Libo Zhou, Huiru Guo, Jianguo Cao,
Masakazu Fujimoto, Masaaki Kemmochi
Key Engineering Materials

523-524, 155-160
2012/11

doi:10.4028/www.scientific.net/KEM.523-524.155

Ultrasonic vibration assisted processing is well known for the improvement in machined surface quality and processing efficiency due to the reduced forces and tribology-generated heating when grinding hard-brittle materials. We transplanted this philosophy to chemo-mechanical fixed abrasive polishing of optical glass, namely fused silica, in an attempt to improve surface roughness and/or material removal rate. Experiments were conducted to elucidate the fundamental characteristics of chemo-mechanical fixed abrasive polishing of fused silica in the presence and
absence of ultrasonic vibration on a setup with an in-house built gadget. The experimental results show that ultrasonic vibration assisted chemo-mechanical fixed abrasive polishing can yield increased material removal rate while maintaining the surface roughness of manufactured optics compared to conventional fixed abrasive polishing without ultrasonic vibration. The mechanism of material removal in fixed abrasive polishing was also delved. We found that the glass material is removed through the synergic effects of chemical and mechanical actions between abrasives and glass and the resultant grinding swarf contains ample Si element as well as Ce element, standing in stark contrast to the polisher that contains abundant Ce element and minor Si element.
67 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Metal Cutting with Local Hydrostatic Pressure Field Formation
Keito Uezaki, Jun Shimizu, Libo Zhou, Teppei Onuki and Hirotaka Ojima
Key Engineering Materials

523-524, 167-172
2012/11

doi:10.4028/www.scientific.net/KEM.523-524.167

Improving machined surface integrity is one of the important issues in the precision machining. This study aims to develop a cutting tool, which enables to generate a local hydrostatic pressure field in the vicinity of the cutting point to suppress the extra plastic flow in the workpiece,
because it is known that materials including metals never cause plastic flow and fracture no matter how much greater hydrostatic pressure field is given. In this paper, a simple cutting tool with planer jig is proposed and a molecular dynamics simulation of cutting is performed as the first step. As a result, it is confirmed that the reduction of the plastic deformation, mainly in the burr formation become remarkable with the proposed model due to the suppression of extra side plastic flow, and relatively high-hydrostatic stress field is formed in the vicinity of cutting point. However, it is also observed that relatively many dislocations are generated beneath the cutting groove.
68 Research paper (international conference proceedings)
Joint
Study on micro/nano-indentation of typical soft-brittle materials
Wei Hang, Libo Zhou, Jun Shimizu,Takeyuki Yamamoto and Julong Yuan
Key Engineering Materials

523-524/ 2012, 7-12
2012/11

10.4028/www.scientific.net/KEM.523-524.7

As a typical multi-functional single crystal material, Lithium tantalite (LiTaO3 or LT) exhibits its excellent electro-optical, piezoelectric properties and has now been widely applied into many applications, such as surface acoustic wave (SAW) filters, isolators and other photoelectron devices. Compared with other functional crystals like silicon and sapphire, LT behaves much more
brittle and softer. The knowledge of precision machining built on conventional hard-and-brittle materials is no longer applicable to this new type of soft-and-brittle crystal. In order to clarify the fundamental mechanical properties of LT, micro/nano-indentation tests are conducted in this study. The obtained results are analyzed and discussed to understand the behavior of this type of materials in their machining process.
69 Research paper (international conference proceedings)
Joint
Research on digital filters for Si wafer surface profile measurement
- Design of filters by total variation -
Hirotaka Ojima, Kazutaka Nonomura, Libo Zhou, Jun Shimizu and Teppei Onuki
Advanced Materials Research

565, 656-661
2012/09

doi:10.4028/www.scientific.net/AMR.565.656

The underlying data form of a wafer is a matrix of length (or height) measurements. In the presence of noise, evaluation parameters are normally biased. The expectation value such as peak-to-valley and GBIR (global backside ideal range) is systematically larger than the “true” value.
Correction and compensation need a large population of measurements to analytically estimate both bias and the uncertainty. In this study, approach to obtain the true value is to extract a “true” profile by filtering noise from the measured data. In previous paper, the digital filter with wavelet transformation (WT) is proposed and efficiency to remove the noise, however, the method is
introduced the pseudo-Gibbs effect. Then, we propose the digital filter with new algorithm of total variation (TV). In this paper, the new algorithm of TV is proposed and the digital filter by new TV indicate that data is filtered without the pseudo-Gibbs effect. The digital filters by WT and new TV are applied on the sample data of actual measurement system to investigate their performance of noise reduction.
70 Research paper (international conference proceedings)
Joint
Study on grinding processing of sapphire wafer
Yutaro Ebina, Wei Hang, Libo Zhou, Jun Shimizu, Onuki Teppei, Hirotaka Ojima and Yoshiaki Tashiro
Advanced Materials Research

565, 22-27
2012/09

doi:10.4028/www.scientific.net/AMR.565.22

This paper reports our recent results on the diamond grinding process of single crystallized sapphire wafers. It was found that the diamond grains were severely dislodged at the wheel/workpiece interface and the material was removed by a mixed process of both grinding and lapping. Grinding governed the wafer center while lapping dominated its fringe. By increasing the wheel speed, it was able to shift the dominant process from lapping to grinding, and achieve a better surface roughness. Nine diamond wheels varying in both concentration and bond material were tested in
surface grinding of 6 inch sapphire wafer, to investigate the dynamic behavior of diamond grain in the grinding process and its resultant surface quality and productivity.
71 Research paper (international conference proceedings)
Joint
Mechanical Properties and Deformation of LiTaO3 Single Crystals Characterised by Nanoindentation and Nanoscratch
Anshun He, Han Huang, Libo Zhou
Advanced Materials Research

565, 564-569
2012/09

doi:10.4028/www.scientific.net/AMR.565.564

This paper reports our recent results on the nanoindentation and nanoscratch of LiTaO3 single crystals. The elastic modulus and hardness of LiTaO3 obtained from nanoindentation were 251±3 GPa and 12.6±0.6 GPa, respectively. During indenting, pop-in events occurred when indentation load was in the range from 305 to 640 μN. Incipient kink bands (IKBs) were believed to be responsible for the pop-ins. Nanoscratching showed that there existed a threshold normal load of 2.5 mN, above which cracks were generated and the material removal was in the brittle regime. The knowledge gained is valuable to the design of an effective machining process for LiTaO3 crystals.
72 Research paper (international conference proceedings)
Joint
Micro laser ablation with 1064nm-wavelength pico-second pulsed laser on monocrystalline lithium niobate surface
Hirofumi Aizawa, Teppei Onuki, Takeyuki Yamamoto, Hirotaka Ojima, Jun Shimizu, Libo Zhou
Proceedings of The 3rd International Conference on Nanomanufacturing (nanoMan2012)

247-250
2012/07




73 Research paper (international conference proceedings)
Joint
Micro EDM Milling Making Greater Use of Electrode Tip Roundness
Akihiro Ueda, Takeyuki Yamamoto, Jun Shimizu, Libo Zhou, Teppei Onuki, Hirotaka Ojima
Proceedings of The 3rd International Conference on Nanomanufacturing (nanoMan2012)

396-399
2012/07




74 Research paper (international conference proceedings)
Joint
Design of Digital Filters for Si Wafer Surface Profile Measurement
- Denoising by Total Variation -
Hirotaka Ojima, Kazutaka Nonomura, Libo Zhou, Jun Shimizu
and Teppei Onuki
Key Engineering Materials

516, 332-336
2012/06

doi:10.4028/www.scientific.net/KEM.516.332

In the semiconductor industry, high resolution and high accuracy measurement is needed for the geometric evaluation of Si wafers. The flatness parameters are important to evaluate the wafer profile and are required to be the same level as the design rule of IC, and the tolerance for flatness is very tight. According to SEMI (Semiconductor Equipment and Materials International) standards, the required wafer flatness will be 22 nanometres by the year 2016. However, to obtain a higher resolution for sensors, the uncertainty becomes very large compared to the resolution and influences the measured data when the noise is increased. High resolution instruments always incorporate a certain degree of noise. In the presence of noise, form parameters are normally biased. Correction and compensation need a large population of measurements to analytically estimate both bias and uncertainty. The estimation is still far from perfect because of the nature of noise. Another approach is to extract a “true” profile by filtering noise from the measured data. For the purpose of noise reduction, low-pass filters by Gaussian smoothing and Fourier transform are often used. The noise is normally considered to be a component of small deviation (amplitude) with high frequency which also takes a normal distribution around zero. However these conventional filters can remove the noise in the spatial frequency domain only. So, it is essential to design a filter capable of removing the noise both in the spatial frequency domain and the amplitude component. Thus, we have designed and developed new type of digital filter for denoising. We introduce two new digital filters. One is
wavelet transform capable of denoising in the spatial frequency domain and amplitude component, and the other is total variation that can be applied to discontinuous signals without introducing artificial Gibbs Effects.
75 Research paper (international conference proceedings)
Joint
Development of Novel Polishing System by Use of Acoustic trap
Tomohiro Inada, Hirotaka Ojima, Libo Zhou, Teppei Onuki
and Jun Shimizu
Key Engineering Materials

516, 326-331
2012/06

doi:10.4028/www.scientific.net/KEM.516.326

Based on the acoustic levitation phenomenon, we have proposed and developed an acoustic levitation/trap system to control the movements of free abrasives for the finishing of inner surfaces. Described in this paper are the theoretical analysis of levitation force generated in a standing wave field, and experimental results of levitation and trap. A simulation is first performed to determine the wave amplitude and frequency required to levitate the actual abrasives. Based on those results, we developed a system which consists of a sound transducer (speaker), a reflector (an aluminium plate), an amplifier and a function generator, and successfully not only levitated but also trapped actual abrasives in a cylindrical tube. It is found that the relation between the size, density of the abrasives and the power of the acoustic field (wave amplitude and frequency) fairly agreed with the theoretical prediction. Also, the kinetics of levitated abrasives including their positions and movements are precisely controllable by varying the wave frequency and switching from one node position to another.
76 Research paper (international conference proceedings)
Joint
Influence of Surface Micro Texture on Photocatalitic Function of Titanium Dioxide Film
Jun Shimizu, Go Kobayashi, Naomi Hasegawa, Takeyuki Yamamoto, Hirotaka Ojima, Teppei Onuki, Libo Zhou
Materials Science Forum

706-709, 2646-2651
2012/01



This study aims to develop a high-functional photocatalytic film, of which surface is regularly textured by the micro machining technique in order to earn the real surface area. In this work, a regularly textured TiO2 film surface was fabricated by anodic oxidizing a pure titanium plate with regularly arrayed micro cutting grooves, and its wettabilty was evaluated. Micro cutting grooves were machined by a 3-axis NC control precision machine tool with a single point diamond cutter. Anodic oxidation experiments were conducted by using the self-developed equipment with diluted acetic acid as the electrolyte. As a result, it was found that the wettability of the TiO2 film surface regularly textured by synchronized 3-axial micro cutting was superior to those of the mirror finished or irregularly textured surfaces under the irradiation environment by the ultraviolet rays.
77 Research paper (scientific journal)
Joint
A study on the diamond grinding of ultra-thin silicon wafers
Libo Zhou, Yebing Tian, Han Huang, Hisashi Sato and Jun Shimizu
Proc. IMechE Part B: Journal of Engineering Manufacture

226/ 1, 66-75
2012/01

DOI: 10.1177/0954405411414768

The demand for ultra-thin silicon wafers is escalating in recent years with the rapid development of miniaturized electronic devices. In this work, diamond grinding was conducted for thinning silicon wafers on an ultra-precision grinding machine. The thinning performance and the minimum wafer thickness were investigated under different grinding conditions. It was found that the grain depth of cut that was used to characterize the overall grinding conditions played an important role in the determination of the final grinding performance. The relationship between the subsurface damage of the ground wafer and the minimum wafer thickness being achieved was also revealed.
78 Research paper (scientific journal)
Joint
近赤外分光計測を用いた薄片シリコンウエハの厚さ計測法
小貫哲平,小野龍典,尾嶌隆裕,清水淳,周立波
砥粒加工学会誌

55/ 12, 729-732
2011/12



超精密研削盤によるシリコンウェハの薄片化工程で用いる機上厚さ計測装置として,近赤外分光計測方式によるウェハ厚さ計について検討を行った.波長600nm~1000nmの分光計測データに現れる特徴からFabry-Perot干渉とLambert-Beer則を原理として用いた厚さ計測法を用い,今回準備した試作機における最小厚さ0.2mまで及ぶ厚さ計測範囲とその計測精度など本方式の厚さ計の原理的な特徴を明らかにした.純シリコンウェハに対する試作装置を用いた計測の実演において最小8.4m厚の薄片シリコンの計測を行うことが出来た.
79 Research paper (scientific journal)
Joint
大口径Siウエハ表面形状の計測評価技術に関する研究,-第1報:ウェーブレット変換を用いたノイズ除去手法の開発-
周 立波,小野真志,尾嶌裕隆,清水 淳
精密工学会誌

77/ 12, 1165-1169
2011/12



In recent semiconductor industry, production and evaluation of ever flatter, thinner and larger Si wafer are required to fulfill the demands in high integration and cost reduction. However, uncertainty in measurement of wafer profile is encountered as a severe problem because the resolution required for analysis of wafer flatness is reaching the limits of available instrument. Thus, the measured profile data always incorporate a certain degree of noise and this noise component behaves to bias the outputs of wafer profile such as SFQR (Site Frontsite least-sQuares focal plane site Range), GBIR (Global Backside Ideal Range), bow, warp and etc.. In order to precisely evaluate the wafer geometry, it is essential to remove the noise from the measured data. Described in this paper is design and development of digital filters for denoising by use of wavelet transform. Compared to the conventional low-pass filters, the developed filter not only provides better performance of decomposition in the spatial frequency domain, but also offers the new capability of filtering in amplitude components.
80 Research paper (international conference proceedings)
Joint
Nanomold Fabrication by Scratching and Its Application to Nanoimprint Lithography
Jun SHIMIZU, Wataru OHSONE, Hirotaka OJIMA, Teppei ONUKI, Libo ZHOU and Takeyuki YAMAMOTO
Proceedings of 6th Int’l Conference on Leading Edge Manufacturing in 21st Century

(CD-ROM)
2011/11




81 Research paper (international conference proceedings)
Joint
Image based defect detection Algorithm by use of wavelet transformation
Kaoru TAKAMORI, Hirotaka OJIMA, Libo ZHOU, Teppei ONUKI, Jun SHIMIZU and Takeyuki YAMAMOTO
Proceedings of 6th Int’l Conference on Leading Edge Manufacturing in 21st Century

(CD-ROM)
2011/11




82 Research paper (scientific journal)
Joint
Siウエハ仕上げ加工に及ぼす加工変質層の影響の解析
清水淳,周立波,小貫哲平,尾嶌裕隆,山本武幸,鈴木直紀
砥粒加工学会誌

55/ 11, 662-667
2011/11




83 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Energy Dissipation Process in Atomic-scale Stick-slip Phenomenon
Jun Shimizu, Libo Zhou and Takeyuki Yamamoto
Proceedings of Int’l Tribology Conference 201

USB
2011/10




84 Research paper (scientific journal)
Joint
Nanogrinding of multi-layered thin film amorphous Si solar panels
Taro Sumitomo, Han Huang, Libo Zhou and Jun SHimizu
International Journal of Machine Tools and Manufacture

51/ 10-11, 797-805
2011/10



Nanogrinding was performed on the cross-sections of amorphous Si thin film solar panels, which are nanoscale multi-layer structures consisting of hard and brittle materials. The deformed structures of the panel cross-sectional surfaces after grinding were investigated using electron and atomic force microscopy. The nanogrinding results were compared with those obtained from polishing and
nanoscratching, demonstrating that the three processes had produced consistent surface characteristics. Though nanogrinding produced nanometric surface roughness with ductile material removal, but could cause cracking, edge chipping and delamination at thin film interfaces. The results of this work are of value for developing the efficient machining process for thin film solar panels and other brittle multi-layer materials.
85 Research paper (scientific journal)
Joint
Finite element analysis of deflection and residual stress on
machined ultra-thin silicon wafers
Y.B. Tian, L. Zhou, Z.W. Zhong, H. Sato, J. Shimizu
Semiconductor Science and Technology

26/ 10, 1-7
2011/10



The demand of ultra-thin silicon wafers is escalating in recent years with the rapid development of miniaturized electronic devices. Residual stress generated in the thinning process has a great influence on machining quality of ultra-thin wafers. This work has developed a 2D axisymmetric finite element (FE) model to predict deflection and full-field residual stress of ground ultra-thin wafers. The FE model consists of two-layer structures i.e. a damage layer induced by the thinning process and a bulk silicon crystal layer without defects. A serial of uniform in-plane strains is applied to the damage layer to simulate machining generated initial stress. A full-field residual stress distribution in a machined ultra-thin wafer is predicted with the developed FE model after the initial stress is released. Based on the FE model, effects of wafer geometrical dimensions and loaded initial strain (or stress) on the maximum compressive/tensile residual stress and the maximum wafer deflection are revealed. The model has finally been verified by comparing the simulated wafer deflection with the measured value. Based on this work, deflection and residual stress of machined ultra-thin wafer can be conveniently predicted.
86 Research paper (international conference proceedings)
Joint
Spectroscopic measurements of silicon wafer thickness for backgrinding process
Teppei Onuki, Naoto Takagi, Jun Shimizu, Hirotaka Ojima and Libo Zhou
Advanced Materials Research

325, 672-677
2011/09



The optical microgauge system by means of near-infrared spectroscopic measurements was proposed as the thickness monitoring tool in the silicon wafer thinning process. The Fabry-Pelot interferometry and Beer’s law were employed as the principles of the system for extracting the wafer thickness from optical spectroscopic system prototyped in this study. The specifications of the system such as the thickness range and resolution were examined on the prototyped system. The filed test verified the developed system available of monitoring Si wafer as thin as 5 um
87 Research paper (international conference proceedings)
Joint
Development of CMG Wheels for Stress Relief in Si Wafer Thinning Process
Yuki Mikami1, Libo Zhou, Jun Shimizu, Hirotaka Ojima,
Yoshiaki Tashiro and Sumio Kamiya
Advanced Materials Research

325, 678-683
2011/09



In recent semiconductor industry, production of ever flatter, thinner and larger Si wafer are required to fulfill the demands in high integration and cost reduction. A severe problem encountered in wafer thinning process is the warp and distortion of wafer induced by the residual stress and subsurface damage. Chemo-mechanical grinding (CMG) process is emerging process which combines the advantages of fixed abrasive machining and chemical mechanical polishing (CMP), offers a potential alternative for stress relief. This paper studies the influence of the wheel manufacturing process on the wheel physical properties. Three-factor two-level full factorial designs of experiment [1] are employed to reveal the main effects and interacted effects of mixing method and filtration of raw materials on the bending strength and elastic modulus of CMG wheel. The difference in wheel properties is discussed by association with CMG performance including wheel wear, grinding force and surface roughness.
88 Research paper (scientific journal)
Joint
Performance improvement of chemo-mechanical grinding in single crystal silicon machining by the assistance of elliptical ultrasonic vibration
Yongbo Wu and Yaguo Li, Zhenzhong Wang and Wei Yang and Libo Zhou
Int. J. Abrasive Technology

4/ 2, 117-131
2011/07



As a promising technology for the machining of large-sized Si wafer, chemo-mechanical grinding (CMG) integrates the advantages of fixed abrasive machining and chemical mechanical polishing (CMP), and hence can generate superior surface quality comparable to that by CMP while maintaining
the high geometric accuracy. In order to enhance the material removal rate (MRR), attain the work-surface with little damage or defects, and then promote the popularisation of CMG, a new combined grinding method, i.e., elliptical ultrasonic vibration assisted CMG (EUA-CMG), is proposed. Some analysis and experiments were conducted to reveal the processing characteristics of EUA-CMG of single crystal silicon. The result shows that compared with the
conventional CMG without ultrasonic vibration, better surface quality and higher MRR can be attained in EUA-CMG.
89 Research paper (scientific journal)
Joint
Deformation and material removal in a nanoscale multi-layer thin film solar panel using nanoscratch
Taro Sumitomo, Han Huang, Libo Zhou
International Journal of Machine Tools & Manufacture

51/ 3, 182-189
2011/03



Amorphous Si thin filmsolar panels are multi-layer structures consisting of nanometric layers of hard and
brittle materials. The deformation and material removal characteristics of the panel cross-section were investigated using nano-mechanical testing. Nanoindentation and nanoscratching were performed using indenters of various geometries at a range of loads. Atomic force microscopy and electron microscopy were used to study the resulting deformation structures and mechanisms. Plastic deformation of the brittle layers was observed below a critical scratch depth, where material removal occurred without fracture. The critical depth was found to be dependent on indenter geometry and material properties. The indenter tip with the smallest included angle resulted in the greatest scratch depths and material removal. The increased scratching speed also improved the removal efficiency. The results of this work can be applied to develop the ductile regime machining process for thin film solar panels.
90 Research paper (scientific journal)
Joint
Multi-scale deformation and material removal in amorphous Si thin film solar panels
Taro Sumitomo, Libo Zhou, Han Huang
International Journal of NanoManugacturing

7/ 1, 39-53
2011/01



As modern electronic devices become smaller, they are increasingly making use of thin film multi-scale structures consisting of nano-layers with very different material properties. This makes their mechanical behavior at very small scales important in terms of machining. In this study, the deformation and removal characteristics of cross-sections of amorphous Si thin film solar panels were investigated at macro-, micro- and nano- scales using grinding, polishing and nanoscratching. Optical, electron, and atomic force microscopy were used to study the resulting deformation mechanisms and structures. Grinding achieved fast material removal but resulted in damage to the layers, while polishing obtained low material removal rate but the thin film layers of brittle material remained intact due to ductile mode behavior. Nanoscratching was used to simulate the single cutting processes involved in grinding and polishing and demonstrated that brittle and ductile behaviors could be controlled by adjusting the load and tip geometry.
91 Research paper (international conference proceedings)
Joint
Development of Electrodes with Micro Ploughing Patterns for MEMS Applications
Jun Shimizu, Naoki Suzuki, Libo Zhou, Teppei Onuki, Hirotaka Ojima, Takeyuki Yamamoto, Han Huang
Extended Abstract of International Tribology Congress - ASIATRIB 2010, Australia

1162
2010/12




92 Research paper (international conference proceedings)
Joint
Ductile regime deformation and material removal in nanoscale multilayers of thin film amorphous silicon solar cells
Taro Sumitomo, Han Huang, Libo Zhou
Proceeding of 4th CIRP International Conference on High Performance Cutting

Vol.2, 95-98
2010/10/24




93 Research paper (international conference proceedings)
Joint
Grinding and polishing of nanolayered structures:
Thin film amorphous silicon solar panels
Taro Sumitomo, Libo Zhou, Han Huang
Advanced Materials Research

126-128, 817-822
2010/09




94 Research paper (international conference proceedings)
Joint
Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si wafer
WANG Zhen Zhong, Y. WU, L. ZHOU, GUO Yin Biao and WU Chen Xu
Advanced Materials Research

126-128, 282-288
2010/09




95 Research paper (international conference proceedings)
Joint
Improvement in oxide-pattern sizes controllability on scanning probe nanolithography
Teppei Onuki, Takashi Tokizaki, Ojima Hirotaka, Jun Shimizu and Libo Zhou
Advanced Materials Research

126-128, 701-706
2010/09




96 Research paper (international conference proceedings)
Joint
Design of digital filters for Si wafer surface profile measurement, - Noise reduction by lifting scheme wavelet transform -
Kazutaka Nonomura, Masashi Ono, Libo Zhou, Jun Shimizu, Hirotaka Ojima
Advanced Materials Research

126-128, 732-737
2010/09




97 Research paper (international conference proceedings)
Joint
Grinding and polishing of nanolayered structures: thin film amorphous silicon solar panels
Taro Sumitomo, Libo Zhou, Han Huang
Advanced Materials Research

126-128, 817-822
2010/09




98 Research paper (international conference proceedings)
Joint
Mold Fabricated by Nanoscratching for Nanoimprint Lithography
Wataru Ohsone, Jun Shimizu, Libo Zhou, Hirotaka Ojima, Teppei Onuki, Takeyuki Yamamoto and Han Huang
Advanced Materials Research

126-128, 843-848
2010/09




99 Research paper (international conference proceedings)
Joint
Nanoscratching tests on nanomachined silicon (100) surface using scanning probe microscope
X.M. Song, J. Shimizu, L. Zhou
Proceedings of The 2nd International Conference on Nanomanufacturing (nanoMan2010)

CD-ROM/ No.247
2010/09/24




100 Research paper (international conference proceedings)
Joint
Enhancement of Photocatalytic Reaction of Titanium Dioxide Film by Surface Texturing
Jun Shimizu, Libo Zhou, Kaoru Takamori, Hirotaka Ojima,Takeyuki Yamamoto and Han Huang
Materials Science Forum

654-656, 1784-1787
2010/08




101 Research paper (international conference proceedings)
Joint
Design of Digital Filters for Si Wafer Surface Profile Measurement, - Noise Reduction by Wavelet Transform -
Masashi Ono, Kazutaka Nonomura, Libo Zhou, Jun Shimizu
Key Engineering Materials

447-448, 544-548
2010/07




102 Research paper (international conference proceedings)
Joint
Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer
H. Takahashi, Y.B. Tian, Y. Mikami, J. Shimizu, L. Zhou, Y. Tashiro, H.Iwase and S. Kamiya
Key Engineering Materials

447-448, 106-110
2010/07




103 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Rubbing Phenomena in Ultra-Precision Abrasive Machining
Jun Shimizu, Libo Zhou, Takeyuki Yamamoto and Han Huang
Key Engineering Materials

443, 417-422
2010/06




104 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Chemical Reaction Assisted Grinding of Silicon Wafer by Controlling Interatomic Potential Parameters
Jun Shimizu, Libo Zhou and Takeyuki Yamamoto
Journal of Computational and Theoretical Nanoscience

7/ 10, 1-6
2010/04




105 Research paper (scientific journal)
Joint
Siウエハインフィード研削における切削軌跡密度と機械剛性の影響(第2報:実験的考察)
周 立波,光田孝仁,清水 淳,田 業氷,山本武幸
砥粒加工学会誌

45/ 2, 92-96
2010/02



In the previous report, a new dynamic grinding model of capable to incorporate the effect of cutting path density and the machine tool stiffness has been developed. In this report, the proposed model is verified by an empirical study. The results demonstrate that the dynamic grinding model is able to give a better explanation of interference between the cutting edge and substrate and the geometrical profile generated, compared to the conventional static model. Following the optimal conditions obtained through simulation by the dynamic model, an extremely flat wafer with PV less than 0.5um has been successfully achieved in in-feed grinding scheme.
106 Research paper (scientific journal)
Joint
ポテンシャルパラメータ制御によるシリコンウエハ化学作用援用研削の分子動力学シミュレーション
清水淳,周立波,山本武幸
砥粒加工学会誌

45/ 1, 41-44
2010/01




107 Research paper (scientific journal)
Joint
Siウエハインフィード研削における切削軌跡密度と機械剛性の影響(第1報:モデルと解析)
周 立波,光田孝仁,清水 淳,田 業氷,山本武幸
砥粒加工学会誌

45/ 1, 45-49
2010/01



Many models have been proposed to study the infeed grinding of Si wafers and to understand its effects on the surface generation. However, most exiting models are based on 2D/3D kinematical analysis of the wheel or its cutting edges, thus unable to suggest the behavior at the interface of wheel/substrate including effects of the elastic deformation and the cutting path density. In this paper, a new grinding model of capable to incorporate the machine tool stiffness and the substrate contact rigidity has been developed. By taking the effect of cutting path density into account, this model is able to give a better explanation of interference between the cutting edge and substrate, and the geometrical profile generated in an infeed grinding scheme.
108 Research paper (scientific journal)
Joint
砥粒上すべり現象の分子動力学シミュレーション
清水淳,周立波,山本武幸
砥粒加工学会誌

45/ 12, 751-755
2009/12




109 (MISC) Introduction and explanation (international conference proceedings)
Joint
Molecular Dynamics Simulation
of Influence of Two-dimensional
Stick-slip Phenomenon on
Atomic-scale Friction Anisotropy
Jun Shimizu, Libo Zhou, Hirotaka Ojima and Takeyuki Yamamoto
Proceedings of Asian Symposium for Precision Engineering and Nanotechnology 2009


2009/11/11



A series of molecular dynamics simulations were carried out to clarify the influence of 2-dimensional atomic-scale
stick-slip phenomenon on the surface images and friction anisotropy in AFM surface observation. In the present
simulations, a well defined Cu{100} surface is scanned in the directions of <100>, <110> and <210> by a carbon
atom probe with a simple model where the effect of cantilever stiffness is taken into consideration. From the
simulation results, it is understood that the generation of two-dimensional stick-slip phenomenon is indispensable
to display individual atomic imaging, and the friction coefficient can be classified by the form of atomic-scale
stick-slip phenomenon, of course it is much affected by the scanning/sliding positions as well as the directions at
an atomic-scale.
110 (MISC) Introduction and explanation (international conference proceedings)
Joint
Study on ultra-precision machining process
of silicon-based etalon, - Effects of diamond grinding on breakage of ultra-thin etalon -
Hisashi SATO, Yebing TIAN, Jun SHIMIZU and Libo ZHOU
Proceedings of Asian Symposium for Precision Engineering and Nanotechnology 2009


2009/11/11



Variable dispersion compensator is essential to realize wavelength division multiplexing (WDM) for next
generation (40-Gbit/s) ultrahigh speed optical communication. As one of core components, etalon made of ultrathin
single crystal silicon is highly required. A novel single step ultra-precision machining process with diamond
grinding and chemo-mechanical grinding (CMG) has been recently developed for the fabrication of ultra-thin
silicon-based etalon. An encountered issue in the process is breakage of ultra-thin etalon during diamond
grinding and/or after ground etalon being demounted from chuck table. The influence of grinding conditions on
the breakage of ultra-thin etalon can be categorized in two cases. Indicated in this report was that the breakage
of etalon during grinding was mainly attributed to large grinding force (motor current) while the breakage of
etalon after demounting was mostly dominated by damage degree in the subsurface of ground etalon. The proper
grinding conditions were finally suggested to avoid the breakage in the fabrication process of ultra-thin siliconbased
etalon.
111 Research paper (scientific journal)
Joint
Research on Chemo-Mechanical-Grinding of Large Size Quartz Glass Substrate
Libo ZHOU, Takeshi SHIINA, Zhongjun QIU, Jun SHIMIZU, Takeyuki YAMAMOTO and Toshiaki TASHIRO
Precision Engineering

33, 499-504
2009/10



Finishing process of quartz glass substrate is meeting great challenges to fulfill the requirements of
photomask for photolithography applications. For the final finishing of the substrate surface, chemical
mechanical polishing (CMP) is often utilized. Those free abrasive processes are able to offer a great surface
roughness, but sacrifice profile accuracy. On the other hand, the fixed abrasive process or grinding is
known as a promising solution to improve accuracy of profile geometry, but always introduces damaged
layer. Chemo-mechanical grinding (CMG) is potentially emerging defect-free machining process which
combines the advantages of fixed abrasive machining and CMP. In order to simultaneously achieve high
surface quality and high profile accuracy, CMG process has been applied into machining of large size
quartz glass substrates for photomask use. Reported in this paper are CMG performances in finishing of
quartz glass substrates including material removal rate (MRR), surface roughness, flatness and optical
characteristics.
112 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Chemo-Mechanical Grinding (CMG) by Controlling Interatomic Potential Parameters to Imitate Chemical Reaction
J. Shimizu, L. Zhou and T. Yamamoto
Advanced Materials Research

76-78, 82-86
2009/09




113 Research paper (international conference proceedings)
Joint
Study on Path Control Scheme by Laplacian Potential Field and Configuration Space for Vision Guided Micro Manipulation System
H. Ojima, Y. Yanai, L. Zhou and J. Shimizu
Advanced Materials Research

76-78, 725-730
2009/09




114 Research paper (international conference proceedings)
Joint
Effects of Sodium Carbonate and Ceria Concentration on Chemo-Mechanical Grinding of Single Crystal Si Wafer
H. Takahashi, Y.B. Tian, J. Sasaki J. Shimizu, L. Zhou, Y. Tashiro, H. Iwase, S. Kamiya
Advanced Materials Research

76-78, 728-433
2009/09




115 Research paper (international conference proceedings)
Joint
A Novel Single Step Thinning Process for Extremely Thin Si Wafers
Y.B. Tian, L. Zhou, J. Shimizu, H. Sato and R.K. Kang
Advanced Materials Research

76-78, 434-439
2009/09




116 Research paper (international conference proceedings)
Joint
Modeling and Analysis of Effects of Machine Tool Stiffness and Cutting Path Density on Infeed Surface Grinding of Silicon Wafer
L. Zhou, T. Mitsuta, J. Shimizu and T. Tajima
Advanced Materials Research

76-78, 445-450
2009/09




117 (MISC) Introduction and explanation (scientific journal)
Joint
Siウエハのレーザダイシングに関する研究,
-ピコ秒パルスレーザによる液中加工の検討―
山本武幸,周立波,清水淳,溝口高史
光アライアンス

7, 20-23
2009/07




118 Research paper (scientific journal)
Joint
Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process
Y.B. Tian, L. Zhou, J. Shimizu, Y. Tashiro, R.K. Kang
Journal of Applied Surface Science,

255/ 7, 4205-4211
2009/07



Si wafers are widely used as a substrate material for fabricating ICs. The quality of ICs depends on the
quality of Si wafers. The chemo-mechanical grinding (CMG) with soft abrasive grinding wheels (SAGW)
has been recently found to be a great potential process for machining Si wafers to generate superior
surface quality at low cost. However, there have been very few studies on observing variation of
topography of scratch/texture and understanding basic eliminating process of scratch/texture on the
ground Si wafer. Furthermore, few reports on the variation of surface roughness and material removal
rate (MRR) during CMG process and relationship between MRR and surface roughness during CMG
process are presented. In this paper, a series of CMG experiments have been conducted to study the
elimination process of artificial scratches created on etched Si surfaces and residual textures induced by
SD1500 diamond wheel in CMG process, and to understand the topography variations of Si surfaces and
some basic grinding characteristics during CMG process.
119 Research paper (scientific journal)
Joint
ステレオ視法によるSEM画像の3次元計測および形状復元
尾嶌裕隆, 村上幸博, 大塚春樹, 笹本侑弥, 周立波, 清水淳, 江田弘
精密工学会誌

75/ 6, 499-504
2009/06




120 Research paper (scientific journal)
Joint
Study on a Micro Lathe with Visual Feedback Control
Hirotaka Ojima, Libo Zhou, Jun Shimizu, Hiroshi Eda
International Journal of Abrasive Technology,

2/ 1, 60-69
2009/05



Micromeso Mechanical Manufacturing (M4) technology has
recently attracted attentions as an alternative micromachining solution because of its potentials of processing a wide range of materials into three-dimensional
forms. In this research, using a microlathe, which is installable and operational in a Scanning Electron Microscope (SEM), we control the positions and movements of the cutting tool directly with visual feedback scheme from CCD camera. Unlike the conventional feedback control which positions the X–Y table only, this scheme offers a direct control of the position, path and speed to the tool tip. We compare the tool paths with/without visual feedback control,
and found the error of the path with visual feedback control is within ±5 pixels (30 μm). Cutting test is performed to confirm the effect of the visual feedback control scheme and an average of difference between the resultant shape and the ideal profile is less than 10 μm.
121 Research paper (scientific journal)
Joint
Study on reaction mechanism of Si and pure CeO2 for chemical-mechanical-grinding process
Sumio Kamiya, Hisao Iwase, Keisuke Kishita, Libo Zhou and Hiroshi Eda and Yuji Yoshida
Journal of Vacuum Science and Technology B

27/ 3, 1496-1502
2009/03



The thinning process of silicon wafer for power device in automotive applications requires stress
relief and relatively high Si removal rate. The innovative process of chemical mechanical grinding
CMG has been developed for the surface finishing of Si wafer by means of solid state chemical
reaction with CeO2 abrasives under dry condition. However, the reaction mechanisms of Si and pure
CeO2 in the dry CMG process are yet fully understood. The chips of Si wafer produced during CMG
process were analyzed using x-ray diffraction XRD, transmission electron microscopy TEM, and
TEM/EDX. Those analyses clearly indicated that the chips were thin, elongated, and acicular, as
well as partially curved. The large amount of Si in amorphous phase and CeO2 were detected in the
CMG chips by XRD, except Si crystalline. The reaction experiments between Si and CeO2 were
also performed where the pellets composed of mixed Si/CeO2 powders were heat treated at
400–1200 °C in both air and vacuum 10−4 torr, then quenched. The specimens heated in air and
vacuum above 900 °C contained Si, CeO2, a trace of amorphous phase, CeSi1.9 cerium-silicon
alloy, and Ce4.667Si43O cerium silicate, respectively. This means that the reaction mechanism
in heat treatment of the Si/CeO2 powders is not exactly the same as CMG process. The findings
from analyses of CMG chip products proved that the reaction of 2CeO2+Si→Ce2O3+SiO
amorphous took place during CMG process of Si wafer using CeO2 fixed abrasive. The produced
Ce2O3 can be easily transformed to CeO2 by the reaction Ce2O3+1/2O2→2CeO2.
© 2009 American Vacuum Society.CMGsolid abrasivereaction of Si/CeO2CeO2Sicerium-silicon alloycerium silicate DOI: 10.1116/1.3046145
122 (MISC) Introduction and explanation (scientific journal)
Joint
紫外線照射による酸化チタン膜の親水化反応 == 表面性状が光触媒機能に及ぼす影響 ==
清水淳,周立波,梓沢慶介
光アライアンス

12, 33-36
2008/12




123 Research paper (international conference proceedings)
Joint
Research on 3D Data Acquisition of Live Image
Yuya Sasamoto, Kenta Matsubara, Hirotaka Ojima, Libo Zhou and Jun Shimizu
4th International Student Conference at Ibaraki University

55-60
2008/11




124 (MISC) Introduction and explanation (international conference proceedings)
Joint
Research on Cleavage-Cutting of Silicon Wafer by Ultra Pulsed Laser
Takashi Mizoguchi, Hiroyuki Sugimoto, Libo Zhou, Jun Shimizu, Hirotaka Ojima and Takeyuki Yamamoto
4th International Student Conference at Ibaraki University

61-65
2008/11




125 Research paper (scientific journal)
Joint
微小引っかきによ
るシリコンウエハ研削現象の解析
清水 淳,周 立波,山本武幸,津村貴史,岡部秀光,江田 弘
砥粒加工学会誌

52/ 10, 601-606
2008/10




126 (MISC) Introduction and explanation (international conference proceedings)
Joint
Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding
H. Huang, Y.Q. Wu, Y. Wang, J. Zou and L. Zhou
Key Engineering Materials

389-390, 465-468
2008/09




127 Research paper (international conference proceedings)
Joint
Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
D.M. Guo, Y.B. Tian, R.K. Kang, L. Zhou and M.K. Lei
Key Engineering Materials

389-390, 459-464
2008/09




128 Research paper (international conference proceedings)
Joint
Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation
Yumetaka Suehisa, Toshiaki Aoki, Jun Shimizu, Libo Zhou and Hiroshi Eda
Key Engineering Materials

389-390, 424-429
2008/09




129 Research paper (international conference proceedings)
Joint
Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction
Keisuke Azusawa, Yuta Ishii, Jun Shimizu, Libo Zhou and Hiroshi Eda
Key Engineering Materials

389-390, 417-423
2008/09




130 Research paper (international conference proceedings)
Joint
Study on Improvement of Material Removal Rate in Chemo-mechanical Grinding (CMG) of Si Wafer
J. Sasaki, T. Tsuruga, B. Soltani.H, T. Mitsuta, Y.B. Tian, J. Shimizu, L. Zhou, H. Eda, Y. Tashiro, H. Iwase and S. Kamiya
Key Engineering Materials

389-390, 13-17
2008/09




131 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Effect of Grinding Wheel Stiffness on Nanogrinding Process
Jun Shimizu, Libo Zhou, Hiroshi Eda
International Journal of Abrasive Technology

1/ 3/4, 316-326
2008/09




132 (MISC) Introduction and explanation (international conference proceedings)
Joint
Study on Reaction Mechanism of Si and pure CeO2 for Chemical-mechanical-Grinding(CMG) Process
Sumio Kamiya, Hisao Iwase, Keisuke Kishita, Libo Zhou, Hiroshi Eda and Yuji Yoshida
The 1st International Conference on Nanomanufacturing (nanoMan2008)

1-6
2008/07




133 Research paper (scientific journal)
Joint
Characteristics of Silicon Substrates Fabricated using Nanogrinding and Chemo-Mechanical-Grinding
H. Huang, B.L. Wang, Y. Wang, J. Zou and L. Zhou
Materials Science and Engineering A

A/ 479, 373-379
2008/04




134 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer
Jun Shimizu, Hiroshi Eda, Libo Zhou, Hidemitsu Okabe
Tribology Online

3/ 5, 248-253
2008/03




135 (MISC) Introduction and explanation (international conference proceedings)
Joint
Fundamental Study on Cleavage-Cutting of Silicon Wafer by Ultra-Short Pulsed Laser
Atsushi HAGIYA, Takeyuki YAMAMOTO, Hirotaka OJIMA, Libo ZHOU, Jun SHIMIZU and Hiroshi EDA
Proceeding of The 4th International Conference on Leading Edge Manufacturing in 21st Century

205/ 07, 879-882
2007/11




136 (MISC) Introduction and explanation (international conference proceedings)
Joint
Study on Path Control Scheme for Vision Guided Micro Manipulation System
Hirotaka OJIMA, Hiroyuki ASANO, Genki SHIMIZU, Libo ZHOU, Jun SHIMIZU and Hiroshi EDA
Proceeding of The 4th International Conference on Leading Edge Manufacturing in 21st Century

205/ 07, 605-608
2007/11




137 (MISC) Introduction and explanation (international conference proceedings)
Joint
Study on Nanomachining Process of Si Wafer using an Atomic Force Microscope
Jun SHIMIZU, Takashi TSUMURA, Yumetaka SUEHISA, Libo ZHOU, Hiroshi EDA
Proceeding of The 4th International Conference on Leading Edge Manufacturing in 21st Century

205/ 07, 153-156
2007/11




138 (MISC) Introduction and explanation (international conference proceedings)
Joint
Development of High Performance Wheels for Chemo-Mechanical-Grinding
Yoshiaki Tashiro, Masaaki Kenmochi, Bahman Soitani, Tatsuya Tsuruga, Libo Zhou, Jun Shimizu and Hiroshi Eda
Proceeding of The 4th International Conference on Leading Edge Manufacturing in 21st Century

207/ 07, 69-72
2007/11




139 (MISC) Introduction and explanation (international conference proceedings)
Joint
Research on Chemo-Mechanical-Grinding (CMG) of large size silica glass substrate
Takeshi SHIINA, Libo ZHOU, Zhongjun QIU, Takeyuki YAMAMOTO, Jun SHIMIZU and Hiroshi EDA
Proceeding of The 4th International Conference on Leading Edge Manufacturing in 21st Century

205/ 07, 65-68
2007/11




140 Research paper (scientific journal)
Joint
Formation Mechanism of Nanocrystalline High-Pressure Phases in Silicon during Nanogrinding
Y. Wang, J. Zou, H. Huang, L. Zhou, B.L. Wang and Y.Q. Wu
Nanotechnology

18/ 21, 465705
2007/11




141 Research paper (international conference proceedings)
Joint
Simulation and Experimental Study on Nanoscracthig of Silicon Wafer
Jun Shimizu, Hidemotsu Okabe, Takashi Tsumura, Yumetaka Suehisa, Libo Zhou and Hiroshi EDA
Proceedings of Int’l Conference on Tribology in Manufacturing Process (ICTMP) 2007

307-310
2007/09




142 (MISC) Introduction and explanation (international conference proceedings)
Joint
Development of On-machine 3D Measuring System for Large Size Si Wafer Thinning Process
T. Mitsuta, B. Soltani, T. Tsuruga, J. Sasaki, L. Zhou, J. Shimizu and H. Eda
Proceedings of ISAAT2007

10, 75-81
2007/09




143 (MISC) Introduction and explanation (international conference proceedings)
Joint
Study on Thinning Process of Large Size Si wafer
T. Tsuruga, B. Soltani, J. Sasaki, T. Mitsuta, J. Shimizu, L. Zhou and H. Eda
Proceedings of ISAAT2007

10, 67-73
2007/09




144 (MISC) Introduction and explanation (international conference proceedings)
Joint
3D Data Acquisition and Configuration by Means of Binocular Stereopsis
H. Otsuka, Y. Myrakami, Z. Qiu, H. Ojima, L. Zhou, J.Shimizu and H. Eda
Proceedings of the 35th International MATADOR Conference

16-5, 393-396
2007/07




145 (MISC) Introduction and explanation (international conference proceedings)
Joint
Molecular Dynamics Simulation of AFM/FFM Surface Observation: Influence of Probe Tip Shape
J.Shimizu, L.Zhou and H.Eda
Proceedings of the 35th International MATADOR Conference

11-3, 271-274
2007/07




146 Research paper (scientific journal)
Joint
画像情報を用いたダイヤモンドバイト自動研磨システムの開発
仇 中軍,周 立波,尾嶌裕隆,江田 弘,今井 亨,山田昌隆
砥粒加工学会誌

51/ 5, 284-289
2007/05



The image processing technology has now been widely applied into many areas such as electronics, manufacturing and security. However, most of those applications are based on two dimensional images. Recently, there are increasing demands of 3D information for new applications. The incoming visual information via a digital imaging device (ex. CCD) is
digitized into pixels in plane with color/gray scale. As each pixel contains 2D positional information, the CCD thus offers an 2D orthogonal coordinate, but loses the 3rd dimension in depth for objects in view. The aim of this research is to develop an algorithm for acquisition and configuration of 3D information by means of binocular stereo vision. In this paper, the 3D data acquisition and reconstruction are demonstrated at static SEM stereopairs. Also the accuracy of acquired data is discussed.
147 Research paper (scientific journal)
Joint
Fabrication and evaluation for extremely thin Si wafer
Libo Zhou, Bahman Soltani Hosseini, Tatsuya Tsuruga, Jun Shimizu, Hiroshi Eda,Sumio Kamiya, Hisao Iwase and Yoshiaki Tashiro
Int. J. Abrasive Technology

1/ 1, 94-105
2007/05




148 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Nano Grinding - Influence of Tool Stiffness -
Jun Shimizu, Libo Zhou, and Hiroshi Eda
Int. J. Manufacturing Science & Technology

9/ 1, 69-75
2007/04




149 Research paper (international conference proceedings)
Joint
Experimental and Simulation Research on Influence of Temperature on Nano-Scratching Process of Silicon Wafer
H. Okabe, T. Tsumura, J. Shimizu, L. Zhou and H. Eda
Key Engineering Materials

329, 379-384
2006/09




150 Research paper (international conference proceedings)
Joint
Study on Structure Transformation of Si Wafer in Grinding Process
Libo Zhou, Makoto Yamaguchi, Jun Shimizu1and Hiroshi Eda
Key Engineering Materials

329, 373-378
2006/09




151 Research paper (international conference proceedings)
Joint
Microstructural Analysis for Si wafer after CMG Procces
Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Libo Zhou, Hiroshi Eda and Shun-ichiro Kimura
Key Engineering Materials

329, 367-372
2006/09




152 Research paper (international conference proceedings)
Joint
Path control scheme for vision guided micro manipulation system
Hiroyuki Asano, Tomohiko Ishikawa, Libo Zhou, Jun Shimizu, Hirotaka Ojima, Zhongjun Qiu, Hiroshi Eda
Proceedings of 11th International Conference on Precision Engineering (ICPE)

5, 321-322
2006/08




153 Research paper (international conference proceedings)
Joint
Study on subsurface damage generated in ground Si wafer
Soltani Hossini Bahman, Libo Zhou, Tsuruga Tatsuya, Jun Shimizu, Hiroshi Eda, Sumio Kamiya, Hisao Iwase
Proceedings of 11th International Conference on Precision Engineering (ICPE)

5, 309-313
2006/08




154 Research paper (international conference proceedings)
Joint
Visual Feedback Control of a Micro Lathe
Hirotaka Ojima, Katsuhiro Saito, Libo Zhou, Jun Shimizu, Hiroshi Eda
Proceedings of 11th International Conference on Precision Engineering (ICPE)

5, 133-137
2006/08




155 Research paper (scientific journal)
Joint
Defect-free Fabrication for Single Crystal Silicon Substrate by Chemo-Mechanical Grinding
L. Zhou, H. Eda, J. Shimizu, S. Kamiya, H. Iwase, S. Kimura
Annals of the CIRP

55/ 1, 313-316
2006/08




156 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Vibration-Assisted Micro and Nanocutting: Influences of Vibration, Acceleration and Velocity
Jun Shimizu, Libo Zhou, Hiroshi Eda:
International Journal of Nanomanufacturing

1/ 1, 105-116
2006/07




157 Research paper (scientific journal)
Joint
顕微鏡観察視野外を含む接触圧と接触点維持制御機能を有する半導体デバイス評価用プロービングシステムの開発
石川友彦,江田 弘,周 立波,清水 淳,尾嶌裕隆,山本佳男,川上辰男
砥粒加工学会誌

50/ 6, 318-323
2006/06




158 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Nano Grinding - Influence of Tool Stiffness -
Jun Shimizu, Libo Zhou, Hiroshi Eda
Proceedings of 2006 International Conference on Micro/Nano Fabrication Technologies

MNPX-10.pdf
2006/05




159 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Vibration-Assisted Cutting: Influences of Vibration Parameters
Jun Shimizu, Libo Zhou and Hiroshi Eda
International Journal of Manufacturing Technology and Management

9/ 1/2, 120-129
2006/05




160 Research paper (scientific journal)
Joint
Development of Vision Controlled Bio-Cell Manipulation System
Libo ZHOU, Zhongjun QIU, Tomohiko ISHIKAWA, Tatsuo KAWAKAMI and Hiroshi EDA
International Journal of Manufacturing Technology and Management

9/ 1/2, 130-143
2006/05




161 Research paper (scientific journal)
Joint
電気泳動法によるCMG 砥石の開発とその性能評価
周 立波,戸井田勲,清水 淳,江田 弘
砥粒加工学会誌

50/ 3, 130-133
2006/03




162 (MISC) Introduction and explanation (bulletin of university, research institution)
Joint
電子顕微鏡下用マイクロマニピュレータの開発及び商品化
江田弘,周立波,清水淳,尾嶌裕隆,仇中軍,石川友彦,他10名
茨城大学SVBL第2期プロジェクト報告書

15-22
2005/12




163 Research paper (international conference proceedings)
Joint
Development of a Vision Guided Lathe
Katsuhiro SATO, Hirotaka OJIMA, Libo ZHOU and Hiroshi EDA
Proceedings of International Conference Leading Edge Manufacturing in 21 Century, Nagoya/Japan

1229-1234
2005/10/20




164 Research paper (international conference proceedings)
Joint
Development of Chemo-Mechanical Grinding (CMG) Process
(Surface and Sub-surface Analysis of Si Wafer Produced by CMG)
Libo ZHOU, Yusuke KUMAGAI, Jun SHIMIZU, Hiroshi EDA, Sumio KAMIYA, Hisao IWASE, and Shun’ichiro Kimura
Proceedings of International Conference Leading Edge Manufacturing in 21 Century, Nagoya/Japan

889-892
2005/10/20




165 Research paper (international conference proceedings)
Joint
Simulation on Planarization Process of Patterned Si Wafer (Improvements in accuracy of simulation model)
Hitomi OKUBO, Libo ZHOU, Jun SHIMIZU and Hiroshi EDA
Proceedings of International Conference Leading Edge Manufacturing in 21 Century, Nagoya/Japan

883-888
2005/10/20




166 Research paper (international conference proceedings)
Joint
Molecular Dynamics Analysis on Vibration Assisted Cutting - Effect of Vibration Parameter –
Jun SHIMIZU, Hidekazu TANAKA, Libo ZHOU, Hirotaka OJIMA, Hiroshi EDA
Proceedings of International Conference Leading Edge Manufacturing in 21 Century, Nagoya/Japan,

861-864
2005/10/20




167 Research paper (scientific journal)
Joint
A Novel Fixed Abrasive Process: Chemo-Mechanical Grinding Technology
Libo Zhou, Jun Shimizu and Hiroshi Eda
International Journal of Manufacturing Technology and Management

7/ 5/6, 441-454
2005/07




168 Research paper (scientific journal)
Joint
Effects of Tool Stiffness and Infeed Scheme on Planarization (Integrated model for simulation of planarization process)
Libo Zhou, Jun Shimizu and Hiroshi Eda
International Journal of Manufacturing Technology and Management

7/ 5/6, 490-503
2005/07




169 (MISC) Introduction and explanation (others)
Joint
「茨城大学工学部システム工学科 Micro Machining and Fabrication Laboratory」
江田 弘,周 立波, 清水 淳, 尾嶌裕隆, 山本武幸
砥粒加工学会“[研究室紹介]先端加工技術のデータベース”

30-31
2005/06




170 (MISC) Other article
Only
微細操作用マイクロマニピュレーション装置
周立波
JST首都圏北部四大学発“新技術説明会”

85-88
2005/06




171 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Friction Process in AFM/FFM Surface Observation
J.Shimizu, L.Zhou, H.Eda, H.Ojima
Synopsis of Int. Tribology Conference


2005/05




172 (MISC) Introduction and explanation (others)
Only
CMG砥石の開発と応用,およびダメージフリーの加工へ
周立波
日本機械学会講習会

97/ 05, 593-597
2005/04




173 Research paper (scientific journal)
Joint
SiウエハのChemo-Mechanical-Grinding(CMG)に関する研究,
第2報:固定砥粒によるφ300mm Siウエハの完全表面創成,
周立波,清水淳,江田弘,木村俊一郎
精密工学会誌

71/ 4, 466-470
2005/04




174 Research paper (scientific journal)
Joint
パターンウエハの平坦化シミュレーション(モデルの理論構築)
周立波,大久保瞳,清水淳,江田弘:
日本機械学会論文集C編,

71/ 702, 725-730
2005/02




175 Research paper (international conference proceedings)
Only
Challenge to Defect-free Machining of Ductile/Brittle Materials (Invited Presentation)
Libo Zhou
2004 Annual Meeting of the Chinese Society For Abrasive Machining


2004/12




176 Research paper (international conference proceedings)
Joint
AUTOMATED CELL MANIPULATION SYSTEM BY USE OF VISUAL INFORMATION
Libo Zhou,Zhongjun Qiu, Keisuke Nishida, Tomohiko Ishikawa, Jun Shimizu and Hiroshi Eda
Proceedings of 4th International Workshop on Microfactories
University of Science and Technology of China

1, 152-159
2004/10/18




177 (MISC) Introduction and explanation (others)
Joint
[研究所・研究室紹介]新時代を築く力-マイクロ・ナノテクノロジーの挑戦-茨城大学工学部システム工学科Micro Machining and Fabrication Laboratory
江田 弘,周 立波, 清水 淳, 尾嶌裕隆, 山本武幸
精密工学会誌

70/ 9, 1165-1166
2004/09




178 Research paper (international conference proceedings)
Joint
Simulation on Planarization Process of Device Wafer
L. Zhou, H. Ohkubo, J. Shimizu and H. Eda
Proceedings of ISAAT 2004

393-396
2004/06




179 Research paper (international conference proceedings)
Joint
Development of Cell Manipulation System under Microscope
Z. Qio, L. Zhou, K. Nishida, J. Shimizu, H.Eda and T. Ishikawa
Proceedings of 1st Int’l Conference on Precision Technology

457-461
2004/06




180 Research paper (international conference proceedings)
Joint
Development of Manipulation System for Bio-applications
L. Zhou, Z. Qio, J. Shimizu, H. Eda and T. Ishikawa
Proceedings of 4th euspen International conference

165-166
2004/06




181 Research paper (international conference proceedings)
Joint
Simulation on Effects of Ultra High-Frequency Vibration for Nanomachining
J. Shimizu, H.Tanaka, L.Zhou and H. Eda
Proceedings of 4th euspen International conference

113-114
2004/06




182 Research paper (international conference proceedings)
Joint
Molecular Dynamics Analysis of Ultra High-Acceleration and Vibration Cutting
J. Shimizu, H. Tanaka, L. Zhou, H. Eda
Key Engineering Materials

257-258, 21-26
2004/01




183 Research paper (international conference proceedings)
Joint
Axisymmetric Aspherical Form Generation for Large Diamond Optical Components
L. Zhou, J. Shimizu abd H. Eda
Key Engineering Materials

257-258, 101-106
2004/01




184 Research paper (international conference proceedings)
Joint
Molecular Simulation of Material Removal Mechanism beyond Propagation Speed of Plastic Wave
J. Shimizu, L. Zhou and H. Eda
Proc. of International Conference on LEM21, Niigata/Japan

309-314
2003/11




185 Research paper (international conference proceedings)
Joint
Development of Chemo-Mechanical Grinding (CMG) Process
L. Zhou, S. Kawaii, S. Kimura, J. Shimizu, and H. EDA
Proc. of International Conference on LEM21, Niigata/Japan

315-320
2003/11




186 Research paper (international conference proceedings)
Joint
Manipulation of the Universal Rotational Mechanism for Biological Application
T. Ishikawa, H. Eda, Y. Yamamoto, K. Kawakami, L. Zhou and J. Shimizu
Proc. of 2003 Int’l Symposium on Microelectronics and Human Science, Nagoya/Japan (IEEE Robotics & Automation 2003)

215-219
2003/10




187 Research paper (international conference proceedings)
Joint
Development of Biological-Micro-Manipulation System in Scanning Electron Microscope
H. Eda, T. Ishikawa, Y. Yamamoto, L. Zhou, K. Kawakami and J. Shimizu
Proc. of Int’l Symposium on Microelectronics and Human Science, Nagoya/Japan (IEEE Robotics & Automation 2003)

212-214
2003/10




188 Research paper (scientific journal)
Joint
すべり摩擦・摩耗機構の分子動力学解析,-ゼロ摩耗-摩耗遷移領域の挙動
清水淳,江田弘,周立波
トライボロジスト

48/ 9, 51-61
2003/09




189 Research paper (scientific journal)
Joint
Φ300シリコンウエハ超精密研削加工シミュレーション
佐川克雄,江田弘,周立波,清水淳
砥粒加工学会誌

47/ 8, 440-445
2003/08




190 Research paper (scientific journal)
Joint
Ultrasonic vibration assisted electro-discharge machining of microholes in nitinol
H Huang, H Zhang, L Zhou and H Y Zhen
Journal of Micromechanics and Microengineering

13/ 9, 693-700
2003/06




191 Research paper (scientific journal)
Joint
鋼の微少引っかきに及ぼす第2相合金の影響,第1報:金属粒子適用マイクロファブリケーションの基礎研究
谷山久法,江田弘,清水淳,周立波,中沢由加里,佐藤潤一
砥粒加工学会誌

47/ 5, 263-268
2003/05




192 Research paper (scientific journal)
Joint
Material Removal Mechanism Beyond Plastic Wave Propagation Rate
L.Zhou, J.Shimizu, A.Muroya, H.Ed
Precision Engineering

27/ 2, 109-116
2003/04




193 Research paper (scientific journal)
Joint
Smart Robotic System for 3D Profile Turbine Vane Airfoil Repair
H. Huang, Z.M. Gong, X.Q. Chen and L.Zhou
Int’l Journal of Advanced Manufacturing Technology

21/ 2, 175-184
2003/04




194 Research paper (scientific journal)
Joint
Three-Dimensional Kinematical Analyses for Surface Grinding of Large Scale Substrate
L.ZHOU, K. SHINOHARA, J.SHIMIZU, H.EDA
Precision Engineering

27/ 2, 175-184
2003/04




195 Research paper (international conference proceedings)
Joint
Experimental Investigation of Micro Scratching on Two-Phase Steel: Plastic Flow Mechanism of the Ferrite and Cementite Phase
H. Taniyama, H. Eda, L. Zhou, J. Shimizu
Key Engineering Materials

Vol.238, 2003
2003/03




196 Research paper (scientific journal)
Joint
High Speed Grinding of Silicon Nitride with Resin Bond Diamond Wheels
Han Huang, Lin Ying and Libo Zhou
Journal of Material Processing Technology

141/ 3, 329-336
2003/03




197 Research paper (international conference proceedings)
Joint
Development of Multifunctional Micro-Mchining System and its Applications
L.Zhou, Y. Yaguchi, T. Fuji, J.Shimizu and H.Eda
Key Engineering Materials

Vol.238, 3-8
2003/03




198 Research paper (scientific journal)
Joint
巨大重量主軸台の原子レベル超磁歪位置決め/アライメントシステムの開発, - φ300Siウエハ超加工機械の中核技術 -
江田弘,周立波,中野博民,近藤良,森輝夫,清水淳
精密工学会誌

69/ 1, 100-104
2003/01




199 (MISC) Introduction and explanation (others)
Joint
アメリカにおけるM 4の動向
周立波,厨川常元
砥粒加工学会誌

46/ 12, 593-597
2002/12




200 Research paper (scientific journal)
Joint
Molecular Dynamics Simulation of Contact Process in AFM Surface Observation
J. SHIMIZU, L. ZHOU and H. EDA
Tribotest Journal

9/ 2, 101-105
2002/12




201 Research paper (scientific journal)
Joint
SiウエハのChemo-Mechanical-Grinding(CMG)に関する研究,第1報:CMG砥石の開発
周立波,河合真二,本田将之,清水淳,江田弘,焼田和明
精密工学会誌

68/ 12, 1559-1563
2002/12




202 Research paper (international conference proceedings)
Joint
PM Technology in Giant magnetostrictive Materials Manufacturing and Application Development (Kyoto),
H. Eda, T. Mori, L. Zhou, J. Shimizu, H. Nakano, R. Kondo and K. Watanabe
Proceedings of 2000 Powder Metallurgy World Conference,

1359-1359
2002/11




203 Research paper (international conference proceedings)
Joint
Experimental Investigation of Micro Scratching on Two Phases Alloy Steel - Plastic Flow Mechanism of Ferrite and Cementite Phase -,
H.Taniyama, H.Eda, L.Zhou, J.Shimizu, J.Sato
Proc. of Int. Conf. Advances in Abrasive Technology V, (ISAAT2002), Hong Kong,

15-18
2002/11




204 Research paper (international conference proceedings)
Joint
Development of Multifunctional Micro-Machining System and Applications,
L.Zhou, Y.Yaguchi, T.Fujii, J.Shimizu, H.Eda
Proc. of Int. Conf. Advances in Abrasive Technology V, (ISAAT2002), Hong Kong

3-8
2002/11




205 Research paper (international conference proceedings)
Joint
State-of-the-art Technologies and Kinematical Analysis for One-Stop Finishing of 300mm Si Wafer
L.Zhou, H. Eda, J.Shimizu
Proc. of 10th Int. Manufacturing Conf. in China (IMCC 2002)

1-002.pdf(CD-ROM)
2002/10




206 Research paper (international conference proceedings)
Joint
Simulation and Experimental Analysis of Super High-Speed Grinding of Ductile Material
J.Shimizu, L.Zhou, H.Eda
Proc. of 10th Int. Manufacturing Conf. in China (IMCC 2002),

1-006(CD-Rom)
2002/10




207 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Contact Process in AFM/FFM Surface Observation,
J.Shimizu, L.Zhou, H.Eda:
Proc. of 2nd Asia Int. Conf. on Tribology (ASIATRIB'2002), Korea

61-62
2002/10




208 Research paper (international conference proceedings)
Joint
Crystal Dependence in Micro Scratching of Carbon Steel - Groove Formation of Cementite and Ferrite Phases -
H.Taniyama, H.Eda, J.Sato, J.Shimizu, L.Zhou:
Proc. of 2nd Asia Int. Conf. on Tribology (ASIATRIB'2002), Korea

197-198
2002/10




209 Research paper (international conference proceedings)
Joint
3D Kinematic Analysis of Large Scale Substrate Surface Grinding
Libo ZHOU, Jun SHIMIZU, Kazuhiro SHINOHARA, Hiroshi EDA:
Proceedings of ASPE 2002 Annual Meeting, St. Louis/USA

534-537
2002/10




210 Research paper (scientific journal)
Joint
Simulation and Experimental Analysis of Super High-Speed Grinding of Ductile Material
Jun SHIMIZU, Libo ZHOU, Hiroshi EDA
Journal of Material Processing Technology

129/ 1-3, 19-24
2002/10




211 Research paper (scientific journal)
Joint
熱・電・磁場附加による工具機能の改善に関する研究
周立波,福田勇夫,清水淳,江田弘,加藤明彦
砥粒加工学会誌

46/ 10, 506-509
2002/10




212 Research paper (scientific journal)
Joint
State-of-the-art Technologies and Kinematical Analysis for One-Stop Finishing of Φ300mm Si Wafer
L.Zhou, J.Shimizu, H.Eda
Journal of Material Processing Technology

129/ 1-3, 34-40
2002/10




213 Research paper (scientific journal)
Joint
Robotic grinding and polishing for turbine-vane overhaul
H. Huang, Z.M. Gong, X.Q. Chen, L. Zhou
Journal of Material Processing Technology

127/ 2, 9-14
2002/09




214 Research paper (scientific journal)
Joint
Burr Reduction with Fine-Scrape Cutter
S.Enomoto, T.Ioi, K.Kato, L.Zhou and X.D.Liu
Journal of Material Processing Technology

124/ 1-2, 255-258
2002/06




215 (MISC) Introduction and explanation (others)
Joint
[研究室紹介] 茨城大学工学部システム工学科 Micro Machining and Fabrication Laboratory
江田 弘,周 立波, 清水 淳, 山本武幸
砥粒加工学会誌

46/ 5, 230-231
2002/05




216 (MISC) Introduction and explanation (others)
Joint
Chemo-Mechanical-Grinding
周立波,吉田雄二,江田弘
機械と工具

46/ 5, 33-38
2002/05




217 Research paper (scientific journal)
Joint
Automated Robotic System for Jet Engine Overhaul, - System Design and Development for Honeycomb Repair -
L. ZHOU, H. HUANG
Int’l Journal of Advanced Manufacturing Technology

19/ 5, 370-376
2002/05




218 Research paper (scientific journal)
Joint
大口径シリコンウエハ研削加工における幾何と運動
周立波,篠原一宏,清水淳,江田弘
精密工学会誌

68/ 1, 73-77
2002/01




219 Research paper (scientific journal)
Joint
Φ300Siウエハ超加工機械創作用仕上げ面粗さシミュレーション
佐川克雄,江田弘,周立波,清水淳
砥粒加工学会誌

45/ 12, 574-579
2001/12




220 Research paper (international conference proceedings)
Joint
Improvement of Insert Tool Performance with Electrical/Magnetic Treatment
T. FUKUDA, L. ZHOU, J. SHIMIZU and H. EDA
Proceedings of ISAAT2001

435-438
2001/11




221 Research paper (international conference proceedings)
Joint
Research on Chemo-mechanical Grinding
S. KAWAI, L. ZHOU, J. SHIMIZU and H. EDA:
Proceedings of ISAAT2001

303-306
2001/11




222 Research paper (international conference proceedings)

One Stop Grinding Machine and Process for Φ300 Silicon Wafer (Keynote paper)
L. ZHOU, H. EDA and J. SHIMIZU:
Proceedings of Asia-Pacific Forum on Surface Technology

5-13
2001/11




223 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Superspeed Grinding of Ductile Material
J. Shimizu, L. Zhou and H. Eda:
Proc. 4th Tunisian Interdisciplinary Workshop on Science & Society (TIWSS'2001

75-79
2001/10




224 Research paper (international conference proceedings)

Molecular Dynamics Simulation of Solid Surface Image by Atomic Force Microscope,
J. Shimizu, H. Eda and L. Zhou:
Proc. 4th Tunisian Interdisciplinary Workshop on Science & Society (TIWSS'2001)

70-74
2001/10




225 Research paper (scientific journal)
Joint
大口径φ300Siウエハ用超加工機械の開発
江田弘,周立波,中野博民,近藤良,清水淳,田島琢二
精密工学会誌

67/ 10, 1693-1699
2001/10




226 Research paper (international conference proceedings)
Joint
Simulation Analysis of Contact Process in AFM Surface Observation
J. SHIMIZU, Libo ZHOU and Hiroshi EDA
Proceedings of 2nd World Tribology Conference

61 (+CD-ROM)
2001/09




227 Research paper (international conference proceedings)
Joint
Development of Newly Conceptualized High Water-Content Lubrication Coolant
H. EDA, Libo ZHOU and J. SHIMIZU
Proceedings of 2nd World Tribology Conference

634 (+CD-ROM)
2001/09




228 Research paper (international conference proceedings)
Joint
Simulation and Experimental Analysis of Abrasive Wear in Ultra High-Speed Grinding
J. SHIMIZU, Libo ZHOU, A. MUROYA and H. EDA
Proceedings of 2nd World Tribology Conference,

151 (+CD-ROM)
2001/09




229 Research paper (scientific journal)
Joint
電子顕微鏡内マイクロファブリケーションデバイスの技術開発
江田弘,周立波,守屋光永,川上辰男,石川友彦,山本佳男
精密工学会誌

67/ 8, 52-56
2001/08




230 Research paper (scientific journal)
Joint
Development of Single step Grinding System for Large Scale φ300 Si Wafer,-A Total Integrated Fixed-abrasive Solution-
H.Eda, L.Zhou, H.Nakano, R.Kondo, J.Shimizu
Annals of the CIRP

50/ 1, 225-228
2001/08




231 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation on Dependence of Atomic-Scale Stic-Slip Phenomenon upon Probe Tip Shape
Jun SHIMIZU, Hiroshi EDA and Libo ZHOU
Proceedings of 10th Int'l Conference of Precision Engineering

759-763
2001/06




232 Research paper (international conference proceedings)
Joint
Simulation on High Integrity Surface Generation of Φ300 Si Wafer with Fixed-abrasive Solution
Katsuo SAGAWA, Hiroshi EDA, Libo ZHOU and Jun SHIMIZU
Proceedings of 10th Int'l Conference of Precision Engineering

441-445
2001/06




233 Research paper (scientific journal)
Joint
電子・磁気・光学基板の脆性-延性モードの統合仕上げ加工
周立波,江田弘,清水淳,西村雅也,佐川克雄
砥粒加工学会誌

45/ 6, 244-249
2001/06




234 Research paper (scientific journal)
Joint
Experimental Evaluation of Super High-Speed Grinding of Advanced Ceramics
K. Ramesh, S. H. Yao, S. Gowri and L. ZHOU
Int'l Journal of Advanced Manufacturing Technology

17, 87-92
2001/06




235 Research paper (scientific journal)
Joint
Development of Micro-manipulation System for Operation in Scanning Electron Microscope
Eda, Zhou, Yamamoto, Ishikawa, Kawakami and Shimizu
Int'l Journal for Manufacturing Science and Technology

2/ 2, 107-113
2001/06




236 Research paper (scientific journal)
Joint
POWDER METALLURGIC GIANT MAGNETOSTRICTION MATERIALS AND APPLICATION IN SPACE STRUCTURE
Eda, Mori, Okada, Zhou and Shimizu
Int'l Journal for Manufacturing Science and Technology

2/ 2, 127-133
2001/06




237 (MISC) Introduction and explanation (bulletin of university, research institution)
Joint
ロボット部品の超精密・微細加工のベンチャ・ラボラトリ【複雑機能ロボットプロジェクト】
江田弘,山本佳男,周立波,清水淳
茨城大学SVBL第1期プロジェクト報告書

73-87
2001/03




238 (MISC) Introduction and explanation (others)
Joint
生産技術開発におけるプロジェクトマネジメント
周立波,榎本真三
プロジェクト・マネジメント学会誌

3/ 3, 9-20
2001/03




239 Research paper (scientific journal)
Joint
Automated Robotic System for Jet Engine Overhaul,-Process Development and Enhancement for Honeycomb Repair-
L. ZHOU, H. HUANG, J. SHIMIZU and H. EDA
精密工学会誌

66/ 12, 1895-1900
2000/12




240 (MISC) Introduction and explanation (others)
Joint
超磁歪材料の動向
江田弘,周立波
機械の研究

52/ 11, 16-20
2000/11




241 Research paper (international conference proceedings)
Joint
Microscopic Analysis of Material Deformation in Ultra High-speed Grinding Process
J. Shimizu, H. Eda, L. Zhou, A. Muroiya and Y. Nakazawa
Synopses of Int'l Tribology Conference,

50(+CD-ROM)
2000/11




242 Research paper (international conference proceedings)
Joint
Development of One-Stop Machining System for φ300 Silicon Wafer
Libo ZHOU, Hiroshi EDA, Kazushi WATANABE, Hirotami NAKANO, Ryo KONDO and Jun SHIMIZU
Proceedings of ASPE 2000 Annual Meeting

140-143.
2000/10




243 Research paper (international conference proceedings)
Joint
Material Removal at Ultrahigh Speed
Libo Zhou, Jun Shimizu, Akihito Muroya and Hiroshi Eda
International Symposium on Advanced Abrasive Technology III (ISAAT2000)

438-443
2000/10




244 (MISC) Introduction and explanation (others)
Joint
ドライ環境における超音波振動切削
江田弘,周立波,清水淳,山本武幸,横瀬宏之,福田男夫,奥山経夫
Ultrasonic Technology

12/ 8, 16-20
2000/08




245 Research paper (international conference proceedings)
Joint
Configuration and performance of micro-fabrication system; Micromanipulation under scanning electron/optical microscopy
H. Eda, L. Zhou, T. Ishikawa, T. Kawakami, Y. Yamamoto:
Proceedings of ICEM '2000 (Int'l Conference on Electrical Machine)

1702-1706
2000/08




246 Research paper (international conference proceedings)
Joint
Novel positioning system using a giant magnetostriction actuator for ultra precision and high power applications,
H. Nakano, M. Kosuge, H. Eda L. Zhou, J. Shimizu and Y. Tomita
Proceedings of ICEM'2000 (Int'l Conference on Electrical Machine

462-466
2000/08




247 Research paper (international conference proceedings)
Joint
Development of Powder Metallurgic Giant Magnetostrictive Materials and Their Applications
Hiroshi Eda, Libo Zhou and Jun Shimizu
Proceedings of AMSMA ‘2000 (International Conference on Advanced Manufacturing System & Manufacturing Automation),

117-120
2000/06




248 Research paper (scientific journal)
Joint
Development of High Water-content Cutting Fluids with a New Concept,-Fire Prevention and Environmental Protection
Ii, Eda, Imai, Nishimura,
Kawasaki, Shimizu, Yamamoto and ZHOU
Precision Engineering

24/ 3, 231-236
2000/06




249 Research paper (international conference proceedings)
Joint
Development of One-Stop Mirror Finishing System for Electronic, Magnetic and Optical Components
L.Zhou, H.Eda, J.Shimizu
Proceedings of AMSMA'2000 (International Conference on Advanced Manufacturing System & Manufacturing Automation)

224-228
2000/06




250 Research paper (international conference proceedings)
Joint
Development of Micro-manipulation System for Operation in Scanning Electron Microscope
H. Eda, Y. Yamamoto, T. Ishikawa, L. Zhou and T. Kawakami
Proceedings of SPIE’s 1999 Symposium and Education Program on Micromachining and Microfabrication

310-318
1999/09




251 Research paper (international conference proceedings)
Joint
Powder Metallurgic Giant Magnetostrictive Material and its Applications in Micro-actuator and Micro-sensors
H. Eda, T. Mori, L. Zhou, K. Kubota and J. Shimizu
Proceedings of SPIE's 1999 Symposium and Education Program on Micromachining and Microfabrication

114-123
1999/09




252 Research paper (international conference proceedings)
Joint
Giant Magnetostrictive Positioner for Single Diamond Turning of Silicon Substrate
Hiroshi EDA, Jun SHIMIZU, Libo ZHOU, Yuya TAKIMOTO and Akihito MUROYA
Proceedings of 9th International Conference on Production Engineering

187-192
1999/08




253 Research paper (international conference proceedings)
Joint
Molecular Dynamics Simulation of Fabrication and Wear Process with a Simple Model on Tool Stiffness Effect
Jun SHIMIZU, Hiroshi EDA, Libo ZHOU, and Michisuke JO
Proceedings of 9th International Conference on Production Engineering

1013-1018
1999/08




254 Research paper (international conference proceedings)
Joint
Research and Development of Smart Giant Magnetostriction Materials Using Powder Metallurgic Technology and Their Applications to Advanced Devices
H. Eda, Y. Tomita, T. Mori, Y. Okada, J. Shimizu and L. Zhou
Proceedings of ICCM-12

751(+CD=ROM)
1999/07




255 Research paper (international conference proceedings)
Joint
"An Automated 3D Polishing Robotic System for Repairing Turbine Airfoils",
Chen X.Q., Gong Z.M., Huang H., Zhou L., Ge S.S., Zhu Q. and Woon L.C.,
The 3rd Int. Conf. on Industrial Automation, Canada,

7-9
1999/06




256 Research paper (international conference proceedings)
Joint
Development of System and Key-Components for Ductile Mode Grinding
Hiroshi Eda, Lotfi Chouanine, Jun Shimizu and Libo Zhou
Proceedings of 1st euspen International Conference

222
1999/06




257 Research paper (international conference proceedings)
Joint
Computer Assisted Modeling and Simulation for Grinding Process
Hiroshi Eda, Jun Shimizu and Libo Zhou
Proceedings of 1st euspen International Conference

226-229
1999/06




258 Research paper (international conference proceedings)
Joint
Study on Ultra-Precision Machining of Ceramics for Optical Components.
Hiroshi Eda, Lotfi Chouanine, Jun Shimizu and Libo Zhou
Proceedings of ICOSN '99

420-423
1999/06




259 Research paper (international conference proceedings)
Joint
Development of State-of-Art Devices on the Sub-nanometer Grinding Machine Tool for Optical Glasses
Hiroshi Eda, Lotfi Chouanine, Jun Shimizu and Libo Zhou
Proceedings of ICOSN'99

344-347
1999/06




260 (MISC) Introduction and explanation (bulletin of university, research institution)
Joint
ロボットによる精密研削システムの開発
加藤和彦,榎本真三,五百井俊宏,武田光資郎,川瀬忍,守屋憲一,周立波
千葉工業大学研究報告,理工編

46, 105-111
1999/03




261 Research paper (international conference proceedings)
Joint
High Speed Grinding of Aerospace Component
L. ZHOU, K. Ramesh and J. Goh:
Proceedings of 6th ICPE (International Conference on Precision Engineering'97)

321-325
1997/11




262 Research paper (international conference proceedings)
Joint
Behavior of Bond Tails in Ceramics grinding with a Metal-Bonded Diamond Wheel
J. TAMAKI, T. IYAMA and L. ZHOU:
Proceedings of 6th ICPE (International Conference on Precision Engineering'97),

291-296
1997/11




263 Research paper (scientific journal)
Joint
セラミックスベアリングインナーレース面の総型鏡面研削
周立波,立花亨,庄司克雄,厨川常元,羽賀務,海野邦彦,大下秀男
日本機械学会論文集C編

63/ 612, 2905-2910
1997/08




264 Research paper (international conference proceedings)
Joint
Feasibility Study of A Robotic Polishing System for Aircraft Engine Components
S.Y. LIM, L. ZHOU:
Proceedings of 4th International Conference on Control, Automation. Robotics and Vision

624-628
1996/12




265 Research paper (scientific journal)
Joint
レジンボンドCBNホイールのツルーイングに関する研究 (第1報,ロータリダイヤモンドドレッサによる砥粒切れ刃の形成特性)
趙学暁,庄司克雄,厨川常元,周立波
日本機械学会論文集C編

62/ 601, 3725-3730
1996/09




266 Research paper (international conference proceedings)
Joint
Form Truing/Dressing Technique for Superabrasive Wheels with Complex Profile
L.ZHOU,K.SYOJI, K.YAMAZAKI
Proceedings of ICPE’95

25-28.
1995/11




267 Research paper (scientific journal)
Joint
レジンボンド極微粒ダイヤモンドホイールによる円筒鏡面研削技術の研究
周立波,庄司克雄,厨川常元,海野邦彦,大下秀男
精密工学会誌

61/ 10, 1438-1442
1995/10




268 Research paper (scientific journal)
Joint
マトリックス型ダイヤモンドホイールの研削性能に及ぼす砥粒と結合剤の組み合わせの影響
庄司克雄,唐建設,周立波,河端則次
日本機械学会論文集C編

61/ 586, 2580-2585
1995/04




269 Research paper (scientific journal)
Joint
ビトリファイドCBNホイールにおける砥粒切れ刃の形成特性
庄司克雄,周立波,西田賢一
日本機械学会論文集C編

60/ 574, 2140-2145
1994/06




270 Research paper (scientific journal)
Joint
A New Technique for Truing of Super-abrasive Wheels Used in Form-grinding
L.ZHOU, K.SYOJI, T.KURIYAGAWA
Technical Paper of SME

10/ 93, 1-15
1994/04




271 Research paper (scientific journal)
Joint
Development of Truing Device for Super-abrasive Wheels for Form-grinding
Libo Zhou, Katsuo Syoji and Tsunemoto Kuriyagawa
International Journal of JSPE

27/ 4, 339〜344.
1993/12




272 Research paper (international conference proceedings)
Joint
A New Truing/Dressing Method for Superabrasive Wheels,
L.ZHOU, K.SYOJI,T.KURIYAGAWA
Proceedings of ASPE 8th Annual meeting,

234-237.
1993/11




273 Research paper (international conference proceedings)
Joint
Precision Form Truing and Dressing for Aspheric Ceramic Mirror Grinding,
T. KURIYAGAWA, K. SYOJI, L. ZHOU
NIST Special Publication 847, U.S. Government Printing Office

325-331
1993/06




274 Research paper (international conference proceedings)
Joint
Investigation on the Wear Mechanism of Diamond Wheels during Grinding of Ceramics
J. TANG,K. SYOJI,L. ZHOU:
Proceedings of MODMM'93

204-209
1993/05




275 Research paper (international conference proceedings)
Joint
Truing of Super-abrasive Wheels for Form-grinding,
L. ZHOU,K. SYOJI,T.KURIYAGAWA
Proceedings of the 7th IPES

738-747
1993/05




276 Research paper (scientific journal)
Joint
総型研削用超砥粒ホイールのツルーイング法の開発に関する研究
庄司克雄,厨川常元,周立波,鈴木英雄,相原秀雄
精密工学会誌

59/ 3, 485-490
1993/03




277 Research paper (international conference proceedings)
Joint
Ceramic Mirror Grinding: Using Extremely Fine Grit Diamond Wheel
L. ZHOU,K. SYOJI, T. KURIYAGAWA
Proceeding of ASPE 7th Annual Meeting

79-82.
1992/10




278 Research paper (scientific journal)
Joint
極微粒ホイールのツルーイング,ドレッシング及び研削特性
周立波,厨川常元,庄司克雄
砥粒加工学会誌

36/ 4, 239-244
1992/04




279 Research paper (scientific journal)
Joint
ダイヤモンドホイールにおける砥粒切れ刃の分布
周立波,庄司克雄,厨川常元
砥粒加工学会誌

36/ 1, 35-40
1992/01




280 Research paper (international conference proceedings)
Joint
Truing, Dressing and Grinding Characteristics for Very Fine Grit Diamond Wheels
L. ZHOU,T. KURIYAGAWA,K. SYOJI
CIRP Conference on Precision Engineering and Manufacture System.

375-383
1991/04




281 Research paper (scientific journal)
Joint
Studies on Truing and Dressing of Diamond Wheels (2nd Report)
K.SYOJI,L. ZHOU
International Journal of JSPE

27/ 1, 5-10
1991/02




282 Research paper (scientific journal)
Joint
ダイヤモンド砥石におけるボンドテールの形成機構について
庄司克雄,周立波,田牧純一
精密工学会誌

56/ 7, 1247-1252
1990/07




283 (MISC) Introduction and explanation (others)
Joint
超砥粒ホイールのドレッシングとツルーイングについて
山尾昌道,周立波
マシニスト

5, 80-85
1990/05




284 Research paper (scientific journal)
Joint
Studies on Truing and Dressing of Diamond Wheels (1st Report)
K.SYOJI,L. ZHOU, S.MATSUI
International Journal of JSPE

24/ 2, 124-129
1990/02




285 Research paper (scientific journal)
Joint
ダイヤモンド砥石のツルーイング及びドレッシングに関する研究(第2報
庄司克雄,周立波
精密工学会誌

55/ 12, 2267-2272
1989/12




286 Research paper (scientific journal)
Joint
ダイヤモンド砥石のツルーイング及びドレッシングに関する研究(第1報)
庄司克雄,周立波,松井正己
精密工学会誌

55/ 5, 865-870
1989/05