Ibaraki University's
Graduate School of Science and Engineering (Engineering)
Department of Mechanical Engineering




  1. School of Engineering at Tohoku University, Research Associate 1991/04-1995/03
  2. Singapore Institute of Manufacturing Technology, Senior Research Fellow 1995/04-1998/11
  3. College of Engineering at Ibaraki University, Associate Professor 1998/12-2007/06
  4. College of Engineering at Ibaraki University, Professor. 2007/07-Present

Academic background

  1. Tohoku University Graduate School of Engineering Precision Engineering Doctor prophase 1988/03 Completed
  2. Tohoku University Graduate School of Engineering Precision Engineering Doctor later 1991/03 Completed

Academic degrees

  1. M.Eng Tohoku University 1988/03
  2. Ph.D Tohoku University 1991/04

Current state of research and teaching activities

The activity of nano-engineering Laboratory (nLab), at Ibaraki University, is continuous exploration of new technologies and its practice use in the field of MPE (Manufacturing and Production Engineering). The lab is highly reputed for its achievements in MPE (Micro and Precision Engineering). Currently, the nano-engineering Laboratory is involved in fundamental and applied researches in the areas of (a) damage-free surface generation for electronic/optical materials, (b) Bio-mechatronics, (c) Nano/Micro fabrication and (d) Process modeling & simulation. The nLab has strong ties with industrial partners and government agencies and is well positioned to access many research and employment opportunities. Our mission is to contribute to the society via creation of valuable HR (human resource) and IP (intellectual property).

Research Areas

  1. Micro/Nano fabrication Technology
  2. Precision Engineering/Production Engineering
  3. Intelligent Mechanics/Mechanical System

Research keywords

  1. Precision Engineering, Meso/Micro/Nano Fabrication

Subject of research

  1. Chemo-Mechanical Grinding Defect-free surface generation of Si wafer 2001-Present
  2. Development of Manufacturing Technology for Extremely thin φ300 Silicon wafer. Thining process for Si wafer thiner than 10 um 2002-Present
  3. Development of digital filters 2008-Present
  4. Development of Manufacturing Technology for one-stop processing of φ300 Silicon wafer. 2000-Present
  5. Meso-Micro Mechanical Manufacturing (M4) 2001-Present
  6. Image processing and control 2004-Present
  7. 画像援用加工と制御 CCDカメラからの2D画像情報に基づき,3D形状認識,計測及びそれに基づく制御など 2002/04-Present
  8. Development of maicro manipulation system for bio-engineering application バイオエンジニアリングに必要な自動マニピュレーションシステムを開発する。 2001-2004
  9. Study on Material Removal at Ultra-high Speed 1999-2001
  10. Study on Giant Megnetostrictive Malerials and Applications. 1998-2001

Proposed theme of joint or funded research

  1. Micro Machining technology Wish to undertake joint research with industry and other organizations including private sector. Commisioned research,Joint research
  2. Chemo-Mechanical Grinding Wish to undertake joint research with industry and other organizations including private sector. Commisioned research,Joint research
  3. Wafering etchnology (キーワード) ウエハ,研削加工 Wish to undertake joint research with industry and other organizations including private sector. Technical consultation,Commisioned research,Joint research
  4. Non-conventional machining (Laser machining, Micro EDM) Wish to undertake joint research with industry and other organizations including private sector. Commisioned research,Joint research
  5. Image processing and control Wish to undertake joint research with industry and other organizations including private sector. Commisioned research,Joint research

Research Projects (Competitive Research Funds)

  1. 単結晶サファイアの「機械+化学」ハイブリッド先進加工および評価技術の開発 Science research expense Grant-in-Aid for Scientific Research(A) 日本学術振興会 科研費 2015/04/01-2019/03/31 近年LEDの需要の急増に伴い,基板材である単結晶サファイアウエハの高能率,高精度加工に加えて高品位な加工技術が求められている.申請者らは基盤研究(B)の成果をさらに発展させ,研削プロセスに化学反応を融合したCMG(Chemo-Mechanical Grinding)技術を基盤に,ハイブリッド送り機構を具備した先端加工機械を開発し,単結晶サファイアウエハの形状精度,加工能率と表面品位を並立したOne-stop超精密・無欠陥加工技術及びその評価技術を開発,確立する.
  2. トライボ圧縮静水圧による局所的材料硬化を活用した高品位切削法の新開発 Science research expense Grant-in-Aid for Scientific Research(C) 日本学術振興会 科研費 2015/04/01-2017/03/31
  3. 物理特性を能動的に利用した機能材料高品位加工技術の探索 Science research expense Grant-in-Aid for Exploratory Research 日本学術振興会 萌芽研究 2015/04/01-2017/03/31 携帯電話など無線通信用SAWフィルタに用いるイルメナイト型結晶のLiTaO3やLiNbO3は自発分極を有する強誘電体であり,極めて脆い機械特性に加えて,圧電効果や焦電効果を併せ持つ.加工時の応力状態や熱変動により強い内部電界が発現し,クラックや割れ等を誘発する恐れが加工プロセスの大きな問題になっている.本研究は,加工中の割れの一因である圧電効果と焦電効果の抑制,除去,さらに能動的に利用する方法を探索し,強誘電体の高品位加工の基盤技術を開発する.
  4. ピコ秒レーザによる単結晶ダイヤモンド工具刃先成形とテクスチャリングによる長寿命化 Science research expense Grant-in-Aid for Scientific Research(C) 学術研究助成基金助成金 2013/04/01-2016/03/31 精密切削用単結晶ダイヤモンドバイトの先端は,現在でも職人の手によるダイヤモンド砥粒を用いた研磨(研削)により製作ないし再研磨されている.本研究では,それ対する超短パルスレーザによる液中アブレーション加工の実用性を明らかにする.そこでは,得られたダイヤモンドバイトにより合金材料を実切削し,工具形状転写 性や耐摩耗性などの性能評価も試み,本手法の有効性を明らかにする. さらに,潤滑性向上のために超硬工具などでは試みられている工具表面へのマイクロテクスチャリングを,超短パルスレーザを用いて単結晶ダイヤモンドバイト表面にも導入し,まだ検討も解明もされていないダイヤモンド切削工具表面におけるマイクロテクスチャリングの効果も明らかにする.
  5. 複雑形状管内の非接触駆動研磨除染方式の考案と装置の開発に関する研究 Science research expense Grant-in-Aid for Exploratory Research JSPS 学術研究助成基金助成金 2012/04/01-2014/03/31 本研究は,音響浮揚(Acoustic Levitation)の原理に基づいて,音波により非接触で粒状除染剤を駆動し,制御可能な運動を与えて複雑形状の管内の研磨・除染を行なう方法の考案及び装置の開発を目指す.  福島第一原発の事故以来,配管内の放射線物質の除染が急務になっている.従来の方式は,除染剤の相対運動を与えるため機械式の回転運動や直線運動機構が不可欠で,複雑の配管には対応できない.本研究では,音波を使った粒状の除染剤の浮遊と運動の制御方法を考案し,機械運動機構を必要としない全く新しい研磨除染方式を実現する.


  1. Advances in Abrasive Technology XII Han Huang, Liangchi Zhang, Jun Wang, Zhengyi Jiang, Libo Zhou, Xipeng Xu and Tsunemoto Kuriyagawa Trans Tech Publications 2009/09 0-87849-314
  2. Advances in Abrasive Technology XI Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara Trans Tech Publications 2008/10 0-87849-364-3
  3. [1.5 大口径シリコンウェーハの超精密研削], ”超精密加工と非球面加工”(分担) 周立波(分担) NTS 2004/07
  4. マイクロマシン技術総覧(共著) 周立波 産業技術サービスセンター 2003/01
  5. Advanced Automation Techniques in Adaptive Material Processing(共著) Xiaoqi Chen, Zhiming Gong, Han Huang, Shuzhi Ge, Libo Zhou World Scientific Publishing Co. 2002/09


  1. Research paper (scientific journal) Joint 実験とシミュレーションによる砥粒径のばらつきがウエハ研削面に与える影響の調査 蛯名雄太郎,前崎智博,周立波,清水淳,小貫哲平,尾嶌裕隆,乾正知 精密工学会誌 精密工学会 (採択) 2018
  2. Research paper (scientific journal) Joint Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process Ke Wu, Libo Zhou, Teppei Onuki, Jun Shimizu, Takeyuki Yamamoto and Julong Yuan Precision Engineering Elsevier Online 2018
  3. (MISC) Introduction and explanation (commerce magazine) Only 硬質単結晶ウエハの研削加工の基礎 周立波 機械技術 日刊工業新聞社 66/ 3, 22-27 2018/03
  4. Research paper (scientific journal) Joint Theoretical analysis on effects of grain size variation Libo Zhou, Yutaro Ebina, Ke Wu, Jun Shimizu, Teppei Onuki, Hirotaka Ojima Precision Engineering Elsevier 50/ 10, 27-31 2017 10.1016/j.precisioneng.2017.04.010 Grinding wheels consist of abrasive grains, bonding materials and porous, which are specified by five factors; type of grain, size of grain, bonding material, bonding strength and grain concentration or volume fraction of grain. The grain size is represented by the mean diameter/radius of grains. However, the abrasives in a grinding wheel are randomly scraggly in size and shape. There is no particular aspect to regulate the variation in grain size. This paper addresses, via a theoretical analysis on the distribution of grain size, the average volume of a grain, the number of grains contained in a specific volume of the wheel, the number and protrusion distribution of grains exposed in a wheel working surface and the fraction of effective grain, when the grain size varies. The effect on the resultant finished surface roughness is also discussed.
  5. Research paper (international conference proceedings) Joint Study on Nanoscratching of C-plane Sapphire Wafer Wangpiao Lin, Jun Shimizu, Libo Zhou, Teppei Onuki, Hirotaka Ojima and Takeyuki Yamamoto Proceedings of the 20th International Symposium on Advances in Abrasive Technology (ISAAT2017) 1045-1050 2017/12/03

Research presentations

  1. Oral presentation(general) Study on micro/nano-indentation of typical soft-brittle materials ICPE2012 2012/11/10
  2. Oral presentation(general) Molecular Dynamics Simulation of Metal Cutting with Local Hydrostatic Pressure Field Formation ICPE2012 2012/11/10
  3. Oral presentation(general) Study on grinding processing of sapphire wafer ISAAT2012 2012/09/26
  4. Oral presentation(general) 静水圧場生成型切削工具の開発(第2報)-分子動力学シミュレーションによる平板治具設計- 2012年度精密工学会秋季大会 2012/09/13
  5. Oral presentation(general) ナノインデンテーションにおけるデータ解析手法 ABTEC2012 2012/08/29

Intellectual property rights

  1. Patent 精密加工装置および精密加工方法(特願2005-226419) 特願2005-226419 2005
  2. Patent 精密加工方法(特願2005-107821) 特願2005-107821 2005/04/04
  3. Patent セメンタイトを用いたマイクロマシン用微小機械部品及びその製造方法 特願2004-119961 2004 特開2005-297159
  4. Patent 精密加工装置および精密加工方法(特願2004-380782) 特願2004-380782 2004/12/28
  5. Patent 姿勢制御装置および精密加工装置(特願2004-379810) 特願2004-379810 2004/12/28


  1. 120周年記念功労者賞 2017/11
  2. Master's Professor of the Year 2013/07/17
  3. Master's Professor of the Year 2013/07/17
  4. Master's Professor of the Year 2012/07/19
  5. Master's Professor of the Year 2011/06

Alloted class

  1. Micro Nano Systems (A)
  2. Micro Nano Systems (B)
  3. Ultra precision engineering
  4. Manufacturing & Production
  5. Manufacturing & Production (B)

Memberships of academic societies

  1. China Society of Mechanical Engineering 2007-Present
  2. International Committee for Abrasive Technology 2003-Present
  3. American Society of Precision Engineering 1996-Present
  4. The Japan Society for Mechanical Engineers 1993-Present
  5. Japan Society for Abrasive Technology 1991-Present

Committee Career

  1. (公社)砥粒加工学会 理事,国際交流委員長 2017/04/01-2019/03/31
  2. 日本機械学会 生産加工・工作機械部門 第95期部門運営委員 2017/04/01-2018/03/31
  3. 日本機械学会 英文ジャーナルEditor 2016/04/01-2018/03/31
  4. The Japan Society for Precision Engineering 理事,国際交流委員長 2016/04/01-2018/03/31
  5. 日本機械学会 生産加工・工作機械部門 第94期部門運営委員 2016/04/01-2017/03/31

Mass media, Open sources

  1. 日刊工業新聞 Newspaper 2006/11/01
  2. 日刊工業新聞 Newspaper 2005/05/20
  3. 研磨剤新報 Newspaper 2002/10/15
  4. 日本経済新聞 Newspaper 2002/10/04
  5. 茨城新聞 Newspaper 2002/09/07